5CGXFC4F6M11I7N

The 5CGXFC4F6M11I7N is an Intel Cyclone® V GX FPGA in a 301-TFBGA package designed for mid‑range FPGA applications. It provides 50,000 logic elements, approximately 2.86 Mbits of on‑chip RAM and 129 general‑purpose I/O, delivering the capacity required for industrial control, wireless/wireline communications and military systems.

Built on the Cyclone V device family architecture, this industrial‑grade, surface‑mount device combines compact packaging and a narrow core voltage range to support designs that require deterministic power and temperature performance.

Key Features

• Logic Capacity — 50,000 logic elements for implementing custom digital logic, protocol engines and control functions.
• Embedded Memory — Approximately 2.86 Mbits of on‑chip RAM to store buffers, FIFOs and small lookup tables on the FPGA fabric.
• I/O — 129 I/O pins to support a broad mix of interfaces and board-level connectivity in a compact footprint.
• Power and Core Voltage — Narrow operating supply range of 1.07 V to 1.13 V (core), consistent with Cyclone V family power profiles.
• Operating Temperature — Industrial temperature grade: –40 °C to 100 °C for deployment in harsh environments.
• Package and Mounting — 301‑TFBGA (supplier: 301‑MBGA, 11 × 11) in a surface‑mount format for dense board designs.
• RoHS Compliant — Meets RoHS environmental requirements for lead‑free assembly.
• Cyclone V Family Capabilities — Cyclone V devices are implemented on a 28‑nm low‑power process and the family supports integrated transceivers and hard memory controllers (family‑level attributes from the Cyclone V overview).

Typical Applications

• Industrial Automation — Implement motor control, deterministic I/O aggregation and protocol bridging using the 50,000 logic elements and industrial temperature rating.
• Wireless and Wireline Communications — Use on‑chip RAM and the Cyclone V family’s transceiver and memory controller options for mid‑range communications logic and interface adaptation.
• Military and Rugged Systems — Leverage industrial temperature operation and compact BGA packaging for deployed systems that require robust digital processing.

Unique Advantages

• Balanced Logic and Memory — 50,000 logic elements paired with approximately 2.86 Mbits of embedded RAM enables complex control and buffering without external memory for many designs.
• Industrial Temperature Range — Rated from –40 °C to 100 °C to meet the thermal needs of industrial and rugged applications.
• Compact BGA Footprint — 301‑TFBGA (301‑MBGA, 11 × 11) supports high‑density board layouts while maintaining a surface‑mount assembly process.
• Low Core Voltage Operation — Tight core supply window (1.07 V–1.13 V) helps designs target consistent power characteristics.
• Regulatory Compliance — RoHS‑compliant for lead‑free manufacturing requirements.

Why Choose 5CGXFC4F6M11I7N?

The 5CGXFC4F6M11I7N delivers a practical combination of logic density, embedded memory and I/O in a compact, RoHS‑compliant BGA package targeted at industrial, wireless/wireline and military applications. Its industrial temperature rating and defined core voltage range make it suitable for deployed systems that require predictable electrical and thermal behavior.

Choose this Cyclone® V GX device when you need mid‑range FPGA capacity with on‑chip RAM and a compact package footprint for board designs that demand reliable operation across a wide temperature span.

Request a quote or submit an inquiry for part number 5CGXFC4F6M11I7N to obtain pricing and availability information.