5CGXFC5C6F23A7N

The 5CGXFC5C6F23A7N is an Intel Cyclone® V GX FPGA supplied in a 484‑ball FBGA (23×23) surface‑mount package. This automotive‑grade device is AEC‑Q100 qualified and combines a high logic density with on‑chip embedded memory and flexible I/O to address demanding designs across automotive, industrial, wireless/wireline, and military markets.

With a core supply range of 1.07 V to 1.13 V and an extended operating temperature range of −40 °C to 125 °C, the device is intended for systems that require robust thermal performance and long‑term reliability in harsh environments.

Key Features

• Logic Capacity — 77,000 logic elements to implement complex digital designs and hardware acceleration functions.
• Embedded Memory — Approximately 5.0 Mbits of on‑chip RAM (total RAM bits: 5,001,216) for buffering, lookup tables, and data storage close to logic.
• I/O Count — 240 user I/O pins to support multiple interfaces, sensors, and peripheral connectivity.
• Package — 484‑FBGA (23×23) surface‑mount package providing a compact, manufacturable footprint for high‑density boards.
• Power — Core supply specified between 1.07 V and 1.13 V to match system power architecture.
• Automotive Qualification — AEC‑Q100 qualification and Automotive grade designation for use in automotive applications requiring component qualification.
• Operating Temperature — −40 °C to 125 °C rating suitable for extended temperature environments.
• Environmental Compliance — RoHS compliant to meet lead‑free manufacturing requirements.

Typical Applications

• Automotive Systems — AEC‑Q100 qualification and wide temperature range make this FPGA suitable for in‑vehicle processing, control logic, and sensor aggregation where reliability is required.
• Industrial Control — High logic density and ample embedded memory support motor control, real‑time signal processing, and machine‑control state machines in industrial equipment.
• Wireless and Wireline Infrastructure — The Cyclone V GX family positioning supports integration of transceivers and memory controllers for network equipment and communication endpoints.
• Military and Ruggedized Electronics — Extended temperature range and qualification status suit rugged systems that demand dependable operation across challenging environments.

Unique Advantages

• Automotive‑grade qualification: AEC‑Q100 certification and Automotive grade classification provide confidence for vehicle electronics programs.
• High logic resources: 77,000 logic elements enable implementation of sophisticated control and processing functions without external ASICs.
• On‑chip memory: Approximately 5.0 Mbits of embedded RAM reduces reliance on external memory, improving latency and simplifying board design.
• Robust thermal range: Rated from −40 °C to 125 °C to support applications exposed to wide temperature extremes.
• Compact BGA footprint: 484‑FBGA (23×23) package offers a space‑efficient solution for high‑density, production‑ready assemblies.
• Manufacturing friendliness: Surface‑mount package and RoHS compliance align with modern PCB assembly and regulatory requirements.

Why Choose 5CGXFC5C6F23A7N?

The 5CGXFC5C6F23A7N delivers a balanced combination of logic density, embedded memory, and I/O capacity in an automotive‑qualified Cyclone V GX FPGA. Its validated qualification and extended temperature rating make it well suited for engineers developing robust systems for automotive, industrial, communications, and military segments that require dependable operation over product life cycles.

Designed to integrate into compact, manufacturable PCBs, this device helps reduce system complexity by consolidating logic and memory on‑chip, supporting streamlined BOMs and tighter system integration while meeting regulatory and environmental standards.

Request a quote or submit your requirements to receive pricing and availability information for 5CGXFC5C6F23A7N and discuss lead times and volume options with the supplier.