5CGXFC4C7U19C8N

IC FPGA 224 I/O 484UBGA
Part Description

Cyclone® V GX Field Programmable Gate Array (FPGA) IC 224 2862080 50000 484-FBGA

Quantity 842 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-FBGANumber of I/O224Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18868Number of Logic Elements/Cells50000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2862080

Overview of 5CGXFC4C7U19C8N – Cyclone® V GX FPGA — 50,000 logic elements, 484‑FBGA, 224 I/Os

The 5CGXFC4C7U19C8N is a Cyclone® V GX field-programmable gate array (FPGA) in a 484‑FBGA (484‑UBGA, 19×19) package. It delivers a balanced combination of programmable logic, embedded memory, and high-speed I/O suitable for cost- and power-sensitive designs.

Targeted use cases include industrial control, wireless and wireline systems, and military applications where lower power, integrated transceiver capability, and on-chip memory are valuable. The device operates over a commercial temperature range and complies with RoHS.

Key Features

  • Programmable Logic — 50,000 logic elements for implementing custom logic, state machines, and control functions.
  • Embedded Memory — Approximately 2.86 Mbits of on-chip RAM (2,862,080 bits) to support buffering, lookup tables, and on-chip data storage.
  • High-Density I/O — 224 I/O pins to interface with peripherals, sensors, and external devices.
  • Process and Power — Built on 28‑nm low-power technology with a documented core voltage supply range of 1.07 V to 1.13 V for predictable power budgeting.
  • Package — 484‑FBGA (supplier device package 484‑UBGA, 19×19) surface-mount package for compact board designs.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial environments.
  • Family-Level Capabilities (Cyclone V) — Family features include variable-precision DSP blocks, M10K embedded memory blocks with ECC options, integrated hard memory controllers, and low-power serial transceivers, enabling signal processing and high-bandwidth interfaces where required.
  • RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing processes.

Typical Applications

  • Industrial Control: Implement motor control, PLC logic, and sensor aggregation using the device's logic density and on-chip RAM to handle real-time control tasks.
  • Wireless and Wireline Systems: Use embedded DSP blocks, transceiver-capable fabric, and memory to support modulation, protocol handling, and high-speed interfaces.
  • Military Systems: Leverage the programmable logic and flexible I/O for custom signal processing, protocol adaptation, and system integration in defense applications.

Unique Advantages

  • Balanced Integration: Combines 50,000 logic elements with embedded memory and plentiful I/O to reduce the need for external components and simplify board design.
  • Power-Optimized Core: Narrow documented core voltage range (1.07 V–1.13 V) and 28‑nm low-power technology support tighter power management and predictable thermal design.
  • Compact Packaging: 484‑FBGA (484‑UBGA, 19×19) surface-mount package enables high-density PCB layouts while supporting a large number of I/Os.
  • Family Capabilities: Access to Cyclone V family features such as variable‑precision DSP blocks, M10K memory blocks, and hard memory controllers provides a path to implement complex signal-processing and memory interfaces.
  • Commercial Readiness: RoHS compliance and a commercial temperature rating make the device well-suited for mainstream industrial and communications equipment.

Why Choose 5CGXFC4C7U19C8N?

The 5CGXFC4C7U19C8N positions itself as a versatile Cyclone V GX FPGA option for designers who need substantial programmable logic (50,000 logic elements), meaningful on-chip memory (approximately 2.86 Mbits), and a high I/O count in a compact 484‑FBGA package. Its documented supply voltage window and commercial temperature rating support reliable integration into standard embedded systems.

This device is a practical choice for teams building cost- and power-conscious industrial, wireless/wireline, or military designs that require flexible logic, memory, and interface options without excessive board-level complexity.

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