5CGXFC5C6F27I7N

The 5CGXFC5C6F27I7N is a Cyclone® V GX field‑programmable gate array (FPGA) in a 672‑BGA package, optimized for mid‑density logic and I/O‑centric embedded designs. It combines a 28‑nm low‑power FPGA fabric with high I/O count and on‑chip memory to address industrial, wireless and wireline, military, and automotive market segments.

This device provides approximately 77,000 logic elements, roughly 5 Mbits of embedded RAM, and 336 user I/O pins in a surface‑mount 672‑FBGA (27×27) package, with an industrial operating temperature range and a narrow core supply window for predictable power budgeting.

Key Features

• Process and Core Built on 28‑nm low‑power process technology with a nominal 1.1 V core design; this part’s specified voltage supply range is 1.07 V to 1.13 V for the core.
• Logic Capacity Approximately 77,000 logic elements provide fabric capacity for control, glue logic, and medium‑complexity data processing.
• Embedded Memory Approximately 5 Mbits of on‑chip RAM for buffering, LUT‑based control state, and local data storage.
• I/O and Packaging 336 user I/O pins in a 672‑FBGA (27×27) package; surface‑mount mounting type simplifies PCB assembly for dense designs.
• Transceiver and SoC Family Capabilities As a Cyclone V GX family device, the series includes integrated transceiver and system features documented for Cyclone V devices (family details available in the Cyclone V documentation).
• Industrial Grade and Temperature Range Industrial grade device rated for operation from −40 °C to 100 °C for deployment in temperature‑demanding environments.
• Environmental Compliance RoHS‑compliant construction supports regulatory requirements for lead‑free assemblies.

Typical Applications

• Industrial Control and Automation Use the 336 I/O and industrial temperature range to interface sensors, actuators, and fieldbus devices in factory and process control systems.
• Networking and Wireline/Wireless Infrastructure Mid‑density logic and family transceiver capabilities make this device suitable for data‑path functions, protocol bridging, and timing‑sensitive I/O aggregation.
• Embedded SoC and Heterogeneous Systems Leverage the Cyclone V family’s SoC and hard‑IP features (as documented for the series) for designs that combine processor subsystems and FPGA fabric.
• Test, Measurement, and Instrumentation The combination of logic, embedded RAM, and abundant I/O supports real‑time control, signal routing, and user‑interface tasks in instrumentation platforms.

Unique Advantages

• Right‑sized Logic and Memory: Approximately 77,000 logic elements and ~5 Mbits of embedded memory balance capacity and cost for mid‑range designs.
• High I/O Density: 336 available I/O pins in a compact 672‑FBGA footprint enables dense peripheral and sensor interfacing without external I/O expanders.
• Industrial Reliability: Specified for −40 °C to 100 °C operation, meeting common industrial deployment requirements.
• Narrow Core Voltage Window: Defined 1.07–1.13 V supply range aids predictable power budgeting and system integration.
• RoHS Compliance: Lead‑free, RoHS‑compliant construction simplifies regulatory compliance for commercial products.

Why Choose 5CGXFC5C6F27I7N?

The 5CGXFC5C6F27I7N provides a balanced combination of logic density, embedded memory, and high I/O count in a compact 672‑FBGA package for industrial and infrastructure applications. Its specified core voltage range, industrial temperature rating, and RoHS compliance make it suitable for designs that require predictable power behavior and deployment across challenging thermal environments.

This Cyclone V GX family device is well suited for engineers seeking a mid‑density FPGA with strong I/O capability and family‑level integration features documented for Cyclone V devices, offering a scalable platform for product lines that need consistent performance and long‑term documentation support.

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