5CGXFC5C6M13C6N
| Part Description |
Cyclone® V GX Field Programmable Gate Array (FPGA) IC 175 5001216 77000 383-TFBGA |
|---|---|
| Quantity | 1,330 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 383-MBGA (13x13) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 383-TFBGA | Number of I/O | 175 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 29080 | Number of Logic Elements/Cells | 77000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5001216 |
Overview of 5CGXFC5C6M13C6N – Cyclone® V GX FPGA, 77,000 Logic Elements, 383‑TFBGA
The 5CGXFC5C6M13C6N is a Cyclone® V GX field programmable gate array (FPGA) IC from Intel, designed for cost-sensitive, bandwidth-driven applications. As a member of the Cyclone V family, this device combines a high-density programmable fabric with integrated transceivers and hard memory controller capabilities to address industrial, wireless and wireline, and military application spaces.
Targeted at commercial-temperature designs, the device provides a balance of logic capacity, on-chip memory, I/O count, and a compact surface-mount package for space-constrained boards.
Key Features
- Logic Capacity — 77,000 logic elements (LEs) to implement a wide range of custom logic, control, and datapath functions.
- Embedded Memory — Approximately 5.0 Mbits of embedded memory to support buffering, lookup tables, and intermediate data storage.
- High I/O Count — 175 I/O pins for interfacing to peripherals, sensors, memory, and external devices.
- Integrated High‑Speed IP — Cyclone V devices include integrated transceivers and hard memory controllers, enabling high-bandwidth serial links and efficient external-memory interfacing.
- Process and Core Voltage — Built on TSMC 28‑nm low‑power process technology with a core voltage range of 1.07 V to 1.13 V (nominal 1.1 V), supporting low-power system designs.
- Package and Mounting — Surface-mount 383‑TFBGA package (supplier package 383‑MBGA, 13×13) for compact board-level integration.
- Commercial Grade and Temperature Range — Commercial-grade device specified for 0 °C to 85 °C operating temperature.
- RoHS Compliant — Environmentally compliant per RoHS.
Typical Applications
- Network and Communications Equipment — Implementing high-speed serial interfaces and protocol processing using the device’s integrated transceivers and programmable fabric.
- Industrial Control and Automation — Real-time control, custom I/O aggregation, and deterministic logic functions leveraging the device’s I/O density and embedded memory.
- Signal Processing — DSP pipelines, data buffering, and custom acceleration blocks using the device’s logic resources and on-chip memory.
- Defense and Aerospace Systems — Custom processing, I/O consolidation, and high-bandwidth data paths for military-grade system designs (commercial temperature grade applies).
Unique Advantages
- High Logic Density: 77,000 logic elements provide substantial capacity for complex custom logic and datapath acceleration without external ASIC cost.
- On‑Chip Memory for Real‑Time Data: Approximately 5.0 Mbits of embedded memory reduces dependence on external RAM for many buffering and LUT tasks, simplifying board design.
- Integrated High‑Speed Interfaces: Built-in transceivers and hard memory controller functionality enable robust high-bandwidth links and efficient external memory access.
- Compact Surface‑Mount Package: 383‑TFBGA (383‑MBGA 13×13) supports space-constrained layouts while providing ample I/O for peripheral connectivity.
- Low Core Voltage Operation: Narrow core supply range (1.07–1.13 V) aligns with low-power system design practices and power-supply planning.
- Vendor Documentation and Family Features: Part of the Cyclone V family with series-level features such as 28 nm low-power process architecture and family documentation support.
Why Choose 5CGXFC5C6M13C6N?
The 5CGXFC5C6M13C6N delivers a balanced combination of programmable logic capacity, embedded memory, and I/O resources in a compact surface-mount package for commercial-temperature applications. Its integration of transceiver and hard memory controller functionality—together with a low-voltage 28‑nm process foundation—makes it suitable for designs that require mid-to-high logic density, reliable on-chip memory, and high-bandwidth interfacing while managing board space and BOM complexity.
This device is well suited for engineering teams building communication equipment, industrial controllers, signal-processing blocks, or defense systems that need a programmable, vendor-supported FPGA platform with clear electrical and thermal operating limits.
Request a quote or submit an inquiry to evaluate 5CGXFC5C6M13C6N for your next design. Our team can provide pricing, availability, and support materials to help you move from prototype to production.

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