5CGXFC5C6U19A7N

The 5CGXFC5C6U19A7N is an Intel Cyclone V GX field programmable gate array (FPGA) provided in a 484‑FBGA (484‑UBGA, 19×19) surface‑mount package. It delivers a balance of integration and efficiency for designs that require substantial logic capacity, embedded memory, and flexible I/O in thermally and electrically demanding environments.

Targeted for automotive and other demanding markets, this Cyclone V GX device supports designs in industrial, wireless/wireline and military segments where AEC‑Q100 qualification, a wide operating temperature range, and on‑chip resources reduce system complexity and BOM count.

Key Features

• Logic Capacity — 77,000 logic elements for implementing substantial digital functions and custom acceleration blocks.
• Embedded Memory — Approximately 5.0 Mbits of on‑chip RAM to support frame buffers, FIFOs, and local data storage without external memory.
• I/O Density — 224 user I/O pins to connect sensors, peripherals, high‑speed interfaces, and board I/O directly to the FPGA fabric.
• Automotive Qualification — AEC‑Q100 qualified and specified as Automotive grade, suitable for designs requiring that qualification.
• Operating Range & Power — Core supply range of 1.07 V to 1.13 V and operating temperature from −40 °C to 125 °C for robust performance across harsh conditions.
• Package & Mounting — 484‑FBGA (supplier package 484‑UBGA, 19×19) in a surface‑mount format for compact, assembly‑friendly system designs.
• RoHS Compliant — Meets RoHS environmental requirements for lead‑free manufacturing.
• Family‑Level Architecture — Built on the Cyclone V GX device family architecture that emphasizes low power, integrated hard IP and support for system‑level integration (as documented for Cyclone V devices).

Typical Applications

• Automotive Systems — In-vehicle control units, domain controllers, and sensor fusion systems that require AEC‑Q100 qualification and extended temperature operation.
• Industrial Control — Motor control, PLC I/O aggregation, and factory automation nodes that benefit from high logic density and plentiful I/O.
• Wireless & Wireline Infrastructure — Protocol processing, framing and interface bridging where embedded memory and FPGA logic accelerate data paths.
• Defense & Rugged Electronics — Signal processing and custom logic functions in applications that demand wide temperature capability and part qualification.

Unique Advantages

• Automotive‑grade qualification: AEC‑Q100 certification aligns the device to automotive design and validation flows.
• High logic density: 77,000 logic elements enable complex custom logic, DSP pipelines, and control logic within a single device.
• On‑chip memory to reduce external BOM: Approximately 5.0 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Generous I/O count: 224 I/O pins simplify board routing and allow direct interfacing to many peripherals and sensors.
• Wide thermal and voltage margins: Specified for −40 °C to 125 °C operation with a tight core supply window (1.07–1.13 V) for predictable power budgeting.
• Compact, assembly‑ready package: 484‑FBGA (484‑UBGA, 19×19) surface‑mount footprint minimizes board area while supporting reliable assembly.

Why Choose 5CGXFC5C6U19A7N?

The 5CGXFC5C6U19A7N positions Cyclone V GX capabilities—substantial logic, embedded memory, and broad I/O—in an automotive‑qualified package for applications that require both integration and environmental robustness. Its combination of AEC‑Q100 qualification, extended temperature rating, and on‑chip resources makes it appropriate for automotive and mission‑critical systems where component qualification and system reliability matter.

Designed as part of the Cyclone V family and supplied by Intel, the device is supported by Cyclone V documentation and device resources, enabling efficient hardware and firmware development and migration within the Cyclone V portfolio.

Request a quote or submit an RFQ to get pricing, lead‑time and availability information for the 5CGXFC5C6U19A7N. Our team can provide technical and procurement details to help integrate this device into your design.