5CGXFC5C6M13C7N

The 5CGXFC5C6M13C7N is an Intel Cyclone® V GX field programmable gate array (FPGA) in a 383-TFBGA package. This commercial-grade, surface-mount device integrates a sizeable logic fabric, on-chip memory, and a high I/O count for cost-sensitive, bandwidth-oriented embedded applications.

Built on the Cyclone V device family architecture and designed for low-voltage operation, the device delivers a balance of integration and efficiency suited to wireless/wireline communications, SoC-based embedded systems, and general-purpose digital signal processing tasks.

Key Features

• Logic Capacity – Approximately 77,000 logic elements to implement medium-complexity FPGA designs.
• Embedded Memory – Approximately 5.0 Mbits of on-chip RAM for buffers, FIFOs, and local data storage.
• I/O Density – 175 user I/Os to support high-pin-count interfaces and multiple external peripherals.
• Power and Core Voltage – Core voltage around 1.1 V with an operating supply range of 1.07 V to 1.13 V for low-voltage designs.
• Process Technology – Cyclone V family device built on a 28 nm low-power process, providing reduced power consumption for its class.
• Package and Mounting – 383-TFBGA package (supplier package: 383-MBGA, 13 × 13) with surface-mount assembly for compact board layouts.
• Operating Conditions – Commercial-grade device rated for 0 °C to 85 °C operation.
• RoHS Compliant – Conforms to RoHS requirements for lead-free manufacturing and environmental compliance.

Typical Applications

• Wireless and Wireline Communications – Implements protocol logic, packet processing, and interface bridging where moderate logic and memory capacity are required.
• SoC and Embedded Processing – Combines FPGA fabric with Cyclone V family system features for embedded acceleration and custom peripherals alongside processor subsystems.
• Digital Signal Processing – Supports variable-precision DSP block architectures and on-chip memory for filtering, encoding/decoding, and media pre/post-processing.
• High-Volume, Cost-Sensitive Designs – Suited to applications that require a balance of integration and low power for high-volume production.

Unique Advantages

• Well-balanced integration: Combines substantial logic capacity, embedded memory, and high I/O count in a single 383-TFBGA package to reduce board-level component count.
• Low-voltage operation: Operates around a 1.1 V core with a defined supply window (1.07 V–1.13 V), aiding power-sensitive designs.
• Cost-effective architecture: Part of the Cyclone V family designed for low power and cost-sensitive applications, enabling efficient system-level trade-offs.
• Compact footprint: 13 × 13 supplier package format and surface-mount design support dense PCB layouts and automated assembly.
• Environmental compliance: RoHS status ensures alignment with lead-free manufacturing and regulatory requirements.

Why Choose 5CGXFC5C6M13C7N?

The 5CGXFC5C6M13C7N positions itself as a practical FPGA choice for designers who need approximately 77,000 logic elements, about 5.0 Mbits of embedded memory, and a high I/O count in a compact surface-mount package. Its low-voltage operation and Cyclone V family characteristics make it suitable for bandwidth-focused, cost-aware embedded designs that benefit from integrated FPGA resources.

Selected for projects where integration, predictable power behavior, and a commercial operating temperature range are key, this Cyclone V GX device delivers the system-level capabilities expected from the Cyclone V family while remaining aligned with RoHS requirements and standard surface-mount manufacturing.

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