5CGXFC5C6U19I7N

IC FPGA 224 I/O 484UBGA
Part Description

Cyclone® V GX Field Programmable Gate Array (FPGA) IC 224 5001216 77000 484-FBGA

Quantity 233 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-FBGANumber of I/O224Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs29080Number of Logic Elements/Cells77000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5001216

Overview of 5CGXFC5C6U19I7N – Cyclone V GX FPGA, 77,000 Logic Elements, 484-FBGA

The 5CGXFC5C6U19I7N is an Intel Cyclone® V GX field-programmable gate array (FPGA) in a 484-FBGA package. It delivers a high-density FPGA fabric with integrated features from the Cyclone V family designed for low power and cost-sensitive, high-volume applications.

With 77,000 logic elements, approximately 5.0 Mbits of embedded memory, and integrated transceiver and hard-memory-controller capabilities present in the Cyclone V GX series, this device targets industrial and high-bandwidth system designs that need a balance of integration, power efficiency, and I/O capacity.

Key Features

  • Logic Capacity  Approximately 77,000 logic elements for implementing complex digital logic and control functions.
  • Embedded Memory  Approximately 5.0 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
  • High-density I/O  224 I/O pins to support diverse external interfaces and parallel connectivity.
  • Cyclone V GX Series Integration  Series-level features include integrated transceivers and hard memory controllers, and enhanced 8-input adaptive logic modules—designed to simplify high-bandwidth and memory-intensive designs.
  • Power Supply  Core supply range of 1.07 V to 1.13 V (nominal 1.1 V), matching Cyclone V low-voltage operation characteristics.
  • Package & Mounting  484-FBGA package (supplier package: 484-UBGA, 19 × 19) with surface-mount mounting type for compact board-level integration.
  • Industrial Temperature Range  Rated for operation from -40 °C to 100 °C, suitable for industrial-grade deployments.
  • Standards & Compliance  RoHS-compliant for environmental and manufacturing compatibility.

Typical Applications

  • Industrial Systems  High-density control, signal processing, and protocol bridging in industrial automation and instrumentation, leveraging the device’s logic capacity and industrial temperature range.
  • Wireless and Wireline Infrastructure  Bandwidth-oriented functions where Cyclone V GX series transceivers and hard memory controllers support high-throughput data paths and external memory interfaces.
  • Defense and Ruggedized Electronics  Military market designs that demand reliable operation across wide temperature ranges and robust FPGA integration.

Unique Advantages

  • High logic density: 77,000 logic elements provide the capacity to consolidate multiple functions into a single device and reduce system BOM.
  • On-chip memory for performance: Approximately 5.0 Mbits of embedded RAM enables local buffering and low-latency data handling without external memory for many use cases.
  • Strong I/O capability: 224 I/O pins accommodate parallel interfaces, control signals, and mixed-signal front-ends on modern PCBs.
  • Industrial-ready thermal range: Rated from -40 °C to 100 °C to withstand a wide range of deployment environments.
  • Compact, surface-mount package: 484-FBGA (484-UBGA 19 × 19) lets you implement high-density designs in space-constrained layouts.
  • Environmentally compliant: RoHS compliance simplifies regulatory requirements for global manufacturing.

Why Choose 5CGXFC5C6U19I7N?

The 5CGXFC5C6U19I7N places Cyclone V GX series capabilities—high logic density, embedded memory, extensive I/O, and series-level transceiver and memory-controller integration—into a compact 484-FBGA industrial-grade package. It is well suited to design teams that need a balance of performance, integration, and operational robustness for industrial and high-bandwidth applications.

Engineers specifying this device benefit from a clear set of on-chip resources and electrical/thermal ratings (1.07–1.13 V core supply, -40 °C to 100 °C) that support predictable integration and deployment in volume designs.

Request a quote or submit a sales inquiry to receive pricing, lead-time, and availability information for the 5CGXFC5C6U19I7N.

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