5CGXFC7C7U19C8N

IC FPGA 240 I/O 484UBGA
Part Description

Cyclone® V GX Field Programmable Gate Array (FPGA) IC 240 7880704 149500 484-FBGA

Quantity 244 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-FBGANumber of I/O240Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56480Number of Logic Elements/Cells149500
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits7880704

Overview of 5CGXFC7C7U19C8N – Cyclone V GX Field Programmable Gate Array (FPGA), 240 I/O, 484-FBGA

The 5CGXFC7C7U19C8N is an Intel Cyclone V GX FPGA in a 484-FBGA (484-UBGA, 19×19) package. It combines a high-density programmable fabric with on-chip memory and transceiver-capable I/O to address bandwidth-sensitive applications across wireless, wireline and military markets.

With approximately 149,500 logic elements, roughly 7.88 Mbits of embedded memory, and 240 I/O pins, this commercial-grade, surface-mount device is designed for designs that require a balance of logic capacity, embedded memory, and connectivity while operating at a core supply around 1.1 V.

Key Features

  • Programmable Logic  Approximately 149,500 logic elements provide substantial logic capacity for complex custom functions and system integration.
  • Embedded Memory  Approximately 7.88 Mbits of on-chip RAM (7,880,704 bits) for buffering, FIFOs and local data storage; family architecture includes M10K memory blocks with ECC support.
  • High-speed I/O and Transceivers  240 I/O pins and Cyclone V family transceiver support (family reference to 3.125 Gbps and 6.144 Gbps transceivers) enable high-bandwidth serial and parallel interfaces.
  • DSP and ALM Architecture  Family-level enhanced 8-input adaptive logic modules and variable-precision DSP blocks support efficient implementation of arithmetic and signal-processing functions.
  • Power and Core Voltage  Built on a low-power 28 nm process with a nominal core voltage of 1.1 V; device supply range listed at 1.07 V to 1.13 V for precise core power planning.
  • Package, Mounting and Temperature  484-FBGA (supplier package: 484-UBGA 19×19) for surface-mount assembly; commercial operating temperature range of 0 °C to 85 °C.
  • System IP and Interfaces (family-level)  Cyclone V family includes hard memory controllers and PCIe Gen1/Gen2 hard IP, enabling integration with common external memory and host interfaces.
  • Standards and Compliance  RoHS-compliant manufacturing and a commercial-grade device classification suitable for standard embedded and communications applications.

Typical Applications

  • Wireless Infrastructure  Implement PHY/processing blocks, protocol acceleration and high-speed I/O for basestations and radio equipment using programmable DSP and transceiver-capable I/O.
  • Wireline Communications  Use the device for line-facing logic, protocol handling and packet processing where high I/O density and embedded memory reduce external component count.
  • Military and Defense Systems  Deploy the FPGA for custom signal processing, secure data paths and interface bridging in constrained form factors requiring programmable logic.
  • Embedded Signal Processing  Implement DSP-intensive tasks such as filtering, modulation/demodulation and algorithm acceleration using the device’s DSP blocks and on-chip RAM.

Unique Advantages

  • High Logic Density: Approximately 149,500 logic elements support large custom designs and integration of multiple functions into a single device.
  • Balanced On‑Chip Memory: Roughly 7.88 Mbits of embedded memory reduce dependence on external RAM for many buffering and local storage needs.
  • Transceiver‑Ready I/O: 240 I/O pins combined with family-level high-speed transceiver support enable multi-gigabit links and flexible external connectivity.
  • Low-Power 28 nm Process: Built on a 28 nm low-power process with a nominal 1.1 V core, enabling lower core power consumption when compared to previous-generation technologies.
  • Compact, Surface-Mount Package: The 484-FBGA (19×19 UBGA) package supports space-efficient board designs and industry-standard assembly processes.
  • Commercial Availability and Compliance: RoHS-compliant and specified for 0 °C to 85 °C operation to fit standard commercial embedded designs.

Why Choose 5CGXFC7C7U19C8N?

The 5CGXFC7C7U19C8N provides a substantial logic and memory footprint in a compact FBGA package, making it well suited to designs that combine high logic density, embedded memory and multi‑pin I/O. Its platform ties to the Cyclone V family deliver DSP resources, memory block architectures and high-speed I/O capabilities useful for communications and embedded signal-processing applications.

For development teams and procurement looking for a commercial-grade FPGA from Intel with clear, verifiable specifications—logic element count, on-chip RAM, I/O count, package and operating ranges—this device offers a practical balance of integration and connectivity for mid- to high-complexity designs.

Request a quote or submit an inquiry to receive pricing, availability and lead-time information for part number 5CGXFC7C7U19C8N.

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