5CGXFC7D6F27C6N

IC FPGA 336 I/O 672FBGA
Part Description

Cyclone® V GX Field Programmable Gate Array (FPGA) IC 336 7880704 149500 672-BGA

Quantity 1,266 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BGANumber of I/O336Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56480Number of Logic Elements/Cells149500
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits7880704

Overview of 5CGXFC7D6F27C6N – Cyclone® V GX Field Programmable Gate Array (FPGA) IC 336 7880704 149500 672-BGA

The 5CGXFC7D6F27C6N is an Intel Cyclone® V GX FPGA in a 672-BGA (27 × 27 mm) package. It delivers a high-density programmable fabric with approximately 149,500 logic elements and integrated high-speed resources for bandwidth‑sensitive embedded designs.

Targeted at commercial applications in industrial, wireless and wireline, and military markets, this device combines a 28 nm low-power process architecture with integrated transceivers and hard memory controllers to balance performance, power efficiency, and system integration.

Key Features

  • Logic Capacity Approximately 149,500 logic elements provide substantial programmable fabric for complex control, signal processing, and custom logic implementations.
  • Embedded Memory Approximately 7.88 Mbits of on-chip RAM to support buffering, frame storage, and local data structures.
  • I/O Count 336 user I/Os to connect to peripherals, memories, and high-density system interfaces.
  • High-speed Transceivers Integrated transceivers (family-level capability) to support high bandwidth serial links for wireless and wireline applications.
  • DSP and Logic Architecture Enhanced 8-input adaptive logic modules and variable-precision DSP blocks (family-level features) for efficient implementation of arithmetic and signal-processing functions.
  • Process and Power Built on TSMC 28 nm low-power (28LP) process technology with a nominal core voltage around 1.1 V and specified supply range of 1.07 V to 1.13 V for stable low-voltage operation.
  • Package & Mounting 672‑FBGA (27 × 27 mm) surface-mount package suitable for automated PCB assembly and high-density board designs.
  • Operating Range Commercial grade operation from 0 °C to 85 °C and RoHS-compliant packaging.

Typical Applications

  • Wireless Infrastructure Baseband and front-end processing where integrated transceivers and DSP resources accelerate protocol and signal tasks.
  • Wireline Networking Line cards and packet-processing subsystems that require programmable logic, on-chip RAM buffering, and numerous I/Os.
  • Industrial Control Real-time control, motor drive interfaces, and sensor aggregation leveraging dense logic and on-chip memory for deterministic processing.
  • Military Systems Communications and signal-processing subsystems that benefit from programmable algorithms and high-speed serial links (suitability based on product family positioning).

Unique Advantages

  • High programmable density: Large logic capacity supports complex custom logic, control paths, and multi-function designs within a single device.
  • Integrated bandwidth features: On-chip transceivers and memory controllers reduce external component count and simplify high-throughput system design.
  • Low-voltage operation: Narrow supply range around 1.1 V supports low-power system designs and aligns with 28 nm low-power process characteristics.
  • Balanced memory and DSP resources: Approximately 7.88 Mbits of embedded RAM plus variable-precision DSP blocks enable efficient implementation of buffering and compute-heavy functions.
  • Commercial-grade reliability: Specified commercial operating temperature range and RoHS compliance for mainstream embedded and communication products.

Why Choose 5CGXFC7D6F27C6N?

This Cyclone V GX device is positioned for designers who need substantial programmable logic, integrated high-speed interfaces, and on-chip memory in a compact BGA package. It offers a balance of performance and power economy derived from the 28 nm low-power process and a focused set of system-level features suited to industrial, wireless/wireline, and military applications.

For projects that require scalable logic density, numerous I/Os, and embedded RAM for data buffering and processing, 5CGXFC7D6F27C6N provides a verified platform with family-level enhancements—helping reduce system complexity and component count while enabling faster time to market.

Request a quote or submit an inquiry for 5CGXFC7D6F27C6N to receive pricing and availability information tailored to your production needs.

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