5CGXFC7D6F31A7N

IC FPGA 480 I/O 896FBGA
Part Description

Cyclone® V GX Field Programmable Gate Array (FPGA) IC 480 7880704 149500 896-BGA

Quantity 1,408 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case896-BGANumber of I/O480Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56480Number of Logic Elements/Cells149500
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits7880704

Overview of 5CGXFC7D6F31A7N – Cyclone V GX FPGA, 896‑BGA, Automotive‑Qualified

The 5CGXFC7D6F31A7N is a Cyclone® V GX field‑programmable gate array (FPGA) in an 896‑ball FBGA (31 × 31) package packaged for surface‑mount assembly. Built on the Cyclone V family architecture, it targets applications that require a balance of logic capacity, I/O density, embedded memory and power efficiency across demanding environments.

With heritage features from the Cyclone V family — including a low‑power 28‑nm process architecture, hard memory controller options and transceiver support at the device family level — this device is positioned for industrial, wireless/wireline, military and automotive applications that require a qualified, high‑density programmable fabric.

Key Features

  • Logic Capacity — 149,500 logic elements for complex logic integration and custom hardware acceleration.
  • Embedded Memory — Approximately 7.88 Mbits of on‑chip RAM to support buffering, state storage and embedded data structures.
  • I/O Density — 480 user I/O pins to interface with high‑pin‑count peripherals and parallel buses.
  • Automotive Qualification — Automotive grade device with AEC‑Q100 qualification for designs requiring automotive‑level component qualification.
  • Power and Core Voltage — Core supply specified between 1.07 V and 1.13 V, reflecting tight core voltage requirements for the Cyclone V family.
  • Operating Range — Rated for −40 °C to 125 °C operation to meet extended temperature system requirements.
  • Packaging and Mounting — 896‑FBGA (31 × 31) package in a surface‑mount form factor for compact board designs.
  • Regulatory Status — RoHS‑compliant.
  • Cyclone V Family Capabilities — Series‑level features documented for Cyclone V include TSMC 28‑nm low‑power process technology, integrated hard memory controllers and transceiver support as part of the device family architecture.

Typical Applications

  • Industrial Control — Implement motion control, sensor aggregation and real‑time I/O handling using the device’s large logic fabric, abundant I/O and extended temperature rating.
  • Automotive Systems — AEC‑Q100 qualification and automotive grade classification make this FPGA suitable for vehicle subsystems that require programmable logic and robust environmental tolerance.
  • Communications and Networking — Use the Cyclone V family’s transceiver and memory controller capabilities (series features) with high I/O count for protocol bridging, packet processing and interface aggregation.
  • Defense and Aerospace — Leverage the device’s operating temperature range, logic density and embedded memory for rugged, mission‑critical programmable logic implementations.

Unique Advantages

  • High Logic Density: 149,500 logic elements enable significant on‑chip integration of custom logic and data paths, reducing external components.
  • Substantial Embedded Memory: Approximately 7.88 Mbits of on‑chip RAM provides internal buffering and storage for high‑throughput designs.
  • Automotive‑Grade Qualification: AEC‑Q100 qualification supports deployment in automotive subsystems where component qualification is required.
  • Robust Environmental Range: −40 °C to 125 °C operating range supports applications in harsh or temperature‑variable environments.
  • Compact, High‑Pin Package: 896‑FBGA (31 × 31) delivers high I/O count in a space‑efficient surface‑mount form factor for dense boards.
  • Controlled Core Power Envelope: Narrow core voltage window (1.07 V–1.13 V) assists in predictable power budgeting and thermal design.

Why Choose 5CGXFC7D6F31A7N?

The 5CGXFC7D6F31A7N combines significant logic capacity, substantial embedded RAM and a high I/O count in an automotive‑qualified Cyclone V GX device footprint. It is suited to engineers who need a programmable solution that balances integration, thermal/environmental robustness and predictable power requirements.

Design teams targeting automotive, industrial, communications or defense applications will find this device aligned with long‑life, high‑reliability programs where AEC‑Q100 qualification, extended temperature operation and dense FPGA resources are required.

Request a quote or submit a pricing inquiry to receive availability, lead‑time and ordering information for the 5CGXFC7D6F31A7N.

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