5CGXFC7D6F31C7N

The 5CGXFC7D6F31C7N is an Intel Cyclone® V GX FPGA offering a high-density, low-power programmable fabric optimized for cost-sensitive, bandwidth-driven designs. Built for applications in industrial, wireless and wireline, and military markets, this commercial-grade device combines substantial logic capacity, embedded memory, and high I/O density in a surface-mount 896-FBGA (31×31) package.

This Cyclone V GX device emphasizes integration and power efficiency—providing an FPGA core operating around a 1.1 V domain and leveraging 28 nm low-power process characteristics for designs that require large logic arrays, embedded memory, and abundant I/O.

Key Features

• High Logic Capacity  Provides 149,500 logic elements for complex programmable logic and custom RTL implementations.
• Embedded Memory  Approximately 7.88 Mbits of on-chip RAM to support buffering, lookup tables, and on-chip data storage needs.
• High I/O Count  480 user I/O pins to support dense peripheral interfacing and multi-channel I/O requirements.
• Process and Core Voltage  Built on TSMC 28-nm low-power (28LP) technology with a nominal core voltage of about 1.1 V; supported supply range 1.07 V to 1.13 V.
• Integrated System IP  Cyclone V GX family devices include integrated transceivers and hard memory controller capabilities to simplify high-bandwidth interfaces and external memory integration.
• Package and Mounting  896-FBGA (31×31) surface-mount package for compact board-level integration and high pin density.
• Commercial Temperature and RoHS  Commercial operating range from 0 °C to 85 °C and RoHS-compliant construction.

Typical Applications

• Industrial Networking  Use the device’s high I/O count and embedded memory for protocol bridging, industrial Ethernet endpoints, and real-time control interfacing.
• Wireless and Wireline Infrastructure  Leverage integrated transceivers and hard memory controllers for data path acceleration, PHY interfacing, and mid-range bandwidth processing.
• Military Systems  Employ the FPGA’s logic density and on-chip RAM for custom signal processing, control logic, and interface consolidation in mission-focused designs.

Unique Advantages

• Scalable Logic Resources: 149,500 logic elements provide headroom for feature-rich designs and algorithmic acceleration without external logic expansion.
• Substantial On-Chip Memory: Approximately 7.88 Mbits of embedded RAM reduces dependence on external memory for buffering and intermediate data storage.
• High I/O Density: 480 I/Os enable complex peripheral mixes and multiple parallel interfaces on a single device.
• Low-Voltage Operation: Narrow core supply range (1.07 V–1.13 V) supports low-power design targets and predictable power budgeting.
• Compact, High-Pin Package: 896-FBGA (31×31) provides a compact footprint with high signal density for space-constrained PCBs.
• Regulatory and Build Compliance: RoHS-compliant manufacturing aligns with environmental and assembly requirements for commercial products.

Why Choose 5CGXFC7D6F31C7N?

The 5CGXFC7D6F31C7N Cyclone V GX FPGA balances high logic capacity, significant embedded memory, and a large I/O complement within a compact 896-FBGA package—making it a practical choice for mid- to high-complexity designs that require integration and predictable power characteristics. Its foundation on 28-nm low-power technology and the 1.1 V core domain support lower power profiles while retaining the flexibility of an FPGA fabric.

This device suits engineering teams building cost-sensitive, bandwidth-oriented products in industrial, wireless/wireline, and military segments that need reliable logic resources, on-chip storage, and extensive interfacing without increasing board-level complexity.

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