5CGXFC7D6F31I7

The 5CGXFC7D6F31I7 is an Intel Cyclone® V GX field-programmable gate array provided in a 896-BGA surface-mount package. It delivers 149,500 logic elements and is designed for applications that require a balance of logic capacity, embedded memory and I/O integration.

As a Cyclone V GX device, it incorporates the family’s low-power 28 nm architecture and Cyclone V design features such as integrated transceivers and hard memory controllers, making it suitable for industrial, wireless/wireline and high-bandwidth embedded applications.

Key Features

• Core architecture — Cyclone V GX family built on TSMC's 28-nm low-power process; core supply range specified at 1.07 V to 1.13 V.
• Logic capacity — 149,500 logic elements to implement complex digital functions and state machines.
• Embedded memory — Approximately 7.88 Mbits of on-chip RAM (7,880,704 bits) for buffering, FIFOs and local data storage.
• I/O resources — 480 general-purpose I/O pins to support wide peripheral and bus connectivity.
• High-speed integration — GX variant includes integrated transceivers and hard memory controllers as part of the Cyclone V feature set for higher-bandwidth interface capability.
• Package & mounting — 896-BGA package; supplier device package listed as 896-FBGA (31×31); surface-mount component for standard PCB assembly.
• Operating range & grade — Industrial-grade device rated for operation from −40°C to 100°C.
• Compliance — RoHS-compliant.

Typical Applications

• Industrial automation — Implements control logic, sensor aggregation and custom protocol bridging where industrial temperature range and robust I/O are required.
• Wireless and wireline infrastructure — Uses integrated transceivers and hard memory controllers for packet processing, framing and interface adaptation in communication equipment.
• Defense and aerospace systems — Provides configurable logic capacity and on-chip memory for mission-specific processing and real-time data handling.
• Embedded processing and interface bridging — Combines mid/high logic density with abundant I/O to implement protocol converters, custom peripherals and data buffering.

Unique Advantages

• Substantial logic density — 149,500 logic elements enable implementation of large custom logic blocks and complex state machines without offloading to external logic.
• Built-in memory resources — Approximately 7.88 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• High I/O count — 480 I/Os simplify board-level connectivity for multiple peripherals and parallel interfaces.
• Industrial temperature capability — Rated −40°C to 100°C to meet extended-environment deployment requirements.
• Standardized package footprint — 896-FBGA (31×31) surface-mount package supports established PCB assembly flows and footprint migration across Cyclone V densities.
• Low-voltage operation — Narrow core supply window (1.07–1.13 V) aligned with the Cyclone V low-power process for efficient system design.

Why Choose 5CGXFC7D6F31I7?

The 5CGXFC7D6F31I7 offers a practical combination of logic capacity, on-chip memory and I/O density in an industrial-grade Cyclone V GX device. Its integration of transceivers and hard memory controller features within the Cyclone V family, together with a standardized 896-FBGA footprint and RoHS compliance, make it appropriate for designs that require mid-to-high logic density with reliable environmental performance.

This part is suited to engineering teams building communications, industrial control and embedded processing systems that benefit from the Cyclone V family’s low-power 28 nm architecture and straightforward package migration options across device densities.

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