5CGXFC9A6U19A7N

The 5CGXFC9A6U19A7N is an Intel Cyclone® V GX field-programmable gate array (FPGA) provided in a 484‑FBGA (484‑UBGA, 19×19) surface-mount package. It combines a high logic capacity with on-chip embedded memory and integrated system-level features to address bandwidth‑sensitive and cost‑sensitive applications.

Designed for markets including industrial, wireless/wireline, military, and automotive, this AEC‑Q100 qualified device offers automotive grade reliability and an extended operating range, together with low‑voltage core operation and on‑chip resources for advanced embedded designs.

Key Features

• Logic Capacity — 301,000 logic elements to implement complex digital functions and control logic.
• Embedded Memory — Approximately 14.25 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
• I/O Resources — 240 available I/O pins to support dense external interfacing and multi‑domain connectivity.
• Integrated IP and Interfaces — Enhanced Cyclone V architecture with integrated transceivers and hard memory controller capabilities for higher bandwidth designs.
• Process and Core Voltage — Built on TSMC 28‑nm low‑power (28LP) process with a core supply in the range of 1.07 V to 1.13 V (nominal 1.1 V).
• Package and Mounting — 484‑FBGA (supplier package: 484‑UBGA, 19×19) in a surface‑mount format for compact system integration.
• Automotive Qualification & Temperature Range — AEC‑Q100 qualified with an operating temperature range of −40 °C to 125 °C for automotive and harsh‑environment use cases.

Typical Applications

• Automotive Systems — AEC‑Q100 qualification and −40 °C to 125 °C operation make this FPGA suitable for automotive control, sensor fusion, and in‑vehicle networking where high logic capacity and reliability are required.
• Industrial Automation — Large logic and embedded memory enable motor control, PLC enhancements, and real‑time signal processing in industrial environments.
• Wireless and Wireline Infrastructure — Integrated transceivers and hard memory controller support bandwidth‑intensive networking, protocol offload, and data path acceleration.
• Military and Ruggedized Electronics — Rugged temperature range and high integration allow deployment in mission‑critical systems requiring robust, deterministic logic resources.

Unique Advantages

• High Logic Density: 301,000 logic elements provide the capacity to consolidate multiple functions and reduce external components.
• Substantial On‑Chip RAM: Approximately 14.25 Mbits of embedded memory minimizes reliance on external memory for buffering and state storage.
• Automotive‑Grade Reliability: AEC‑Q100 qualification and extended temperature rating support deployment in automotive and other harsh environments.
• Integrated High‑Bandwidth Features: Cyclone V GX architecture includes integrated transceivers and hard memory controller features to simplify high‑speed data interfaces.
• Low‑Voltage Core Operation: Narrow core supply range (1.07–1.13 V) built on a 28‑nm low‑power process supports efficient power delivery and predictable thermal behavior.
• Compact, Surface‑Mount Package: 484‑FBGA (19×19) package enables dense board layouts while providing ample I/O (240 pins).

Why Choose 5CGXFC9A6U19A7N?

This Cyclone V GX FPGA balances substantial logic capacity, significant on‑chip memory, and integrated high‑bandwidth features in an automotive‑qualified package. It is aimed at designers who need a compact, surface‑mount FPGA that supports complex, bandwidth‑sensitive functions while meeting the temperature and qualification demands of automotive and rugged applications.

With 301,000 logic elements, approximately 14.25 Mbits of embedded RAM, 240 I/Os, and an AEC‑Q100 rating, the 5CGXFC9A6U19A7N is well suited for systems where integration, reliability, and predictable low‑voltage operation are key selection criteria.

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