5CGXFC9A6U19C7N

The 5CGXFC9A6U19C7N is a Cyclone® V GX field programmable gate array (FPGA) in a 484‑FBGA package that delivers high logic density and embedded memory for cost‑sensitive, bandwidth‑driven designs. It integrates a large programmable fabric with on‑chip memory and signal I/O to address applications in industrial, wireless and wireline, and military systems.

Designed as part of the Cyclone V family, this device emphasizes efficient power and system integration while providing the logic, memory, and I/O resources needed for mid‑to‑high complexity FPGA designs.

Key Features

• High Logic Capacity — 301,000 logic elements to implement complex digital functions and custom accelerators.
• Embedded Memory — Approximately 14.25 Mbits of on‑chip RAM for buffering, FIFOs, and storage of intermediate data.
• I/O Resources — 240 general purpose I/O pins to interface with a wide range of peripherals and external devices.
• Process and Core Voltage — Built on TSMC 28‑nm low‑power (28LP) technology with a core supply range of 1.07 V to 1.13 V for optimized power-performance tradeoffs.
• Integrated System Features — Cyclone V devices are enhanced with integrated transceivers and hard memory controllers to support higher bandwidth external interfaces (as described in Cyclone V family documentation).
• Package and Mounting — Supplied in a 484‑FBGA (supplier package: 484‑UBGA, 19×19) surface‑mount package for compact board integration.
• Operating Conditions — Commercial grade operation from 0 °C to 85 °C with RoHS compliance for regulatory conformance.

Typical Applications

• Industrial Control — Motor control, PLC I/O aggregation, and deterministic logic functions leveraging the device’s large logic capacity and on‑chip memory.
• Wireless and Wireline Infrastructure — Packet buffering, packet processing, and protocol bridging using abundant RAM and high I/O counts.
• Military and Ruggedized Systems — Embedded processing and custom signal processing blocks where reconfigurable logic and memory are required (within commercial temperature range constraints).

Unique Advantages

• High integration density: 301,000 logic elements reduce the need for multiple discrete components and simplify board-level design.
• Substantial embedded memory: Approximately 14.25 Mbits of on‑chip RAM enables local data storage and reduces external memory bandwidth requirements.
• Generous I/O count: 240 I/Os allow flexible interfacing to sensors, peripherals, and external memory devices.
• Low‑voltage core operation: Narrow core supply range (1.07 V–1.13 V) supports efficient power provisioning and predictable power budgeting.
• Compact, surface‑mount packaging: 484‑FBGA (484‑UBGA, 19×19) offers a balanced footprint for space-constrained boards.
• RoHS compliant: Environmentally compliant manufacturing supports global production requirements.

Why Choose 5CGXFC9A6U19C7N?

The 5CGXFC9A6U19C7N positions itself as a scalable, high‑density FPGA option within the Cyclone V GX family, combining a significant logic element count with multi‑Mbit embedded RAM and a large I/O complement. Its 28‑nm low‑power heritage and defined core voltage range make it appropriate for designs that prioritize a balance of performance, integration, and power efficiency.

This device is well suited for engineers and procurement teams building mid‑to‑high complexity systems in industrial, wireless/wireline, and military application spaces who need a reconfigurable platform with substantial on‑chip resources and a compact BGA package.

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