5CGXFC9A6U19I7N

The 5CGXFC9A6U19I7N is an Intel Cyclone V GX field-programmable gate array (FPGA) supplied in a 484-ball FBGA (484-UBGA, 19×19) surface-mount package. This industrial-grade device provides a high-density programmable fabric with extensive I/O, on-chip memory and family-level enhancements aimed at bandwidth-oriented and cost-sensitive embedded systems.

Targeted market segments for Cyclone V devices include industrial, wireless and wireline, and military applications where a balance of integration, power efficiency and I/O capacity is required. The device combines approximately 301,000 logic elements and roughly 14.25 Mbits of embedded memory with 240 user I/Os and an industrial operating range to address demanding embedded designs.

Key Features

• Logic Capacity  Approximately 301,000 logic elements for implementing complex digital logic and control functions.
• Embedded Memory  Approximately 14.25 Mbits of on-chip RAM for buffers, FIFOs and local storage.
• I/O Density  240 user I/Os to connect to sensors, interfaces and external memory or peripherals.
• Family-Level High-Speed & Memory IP  Cyclone V devices are documented with integrated transceivers and hard memory controllers to support high-bandwidth interfaces (family-level feature).
• Process and Core Voltage  Device family is built on a 28-nm low-power process with core supply chemistry consistent with the specified operating range; this part’s supply is specified at 1.07 V to 1.13 V.
• Temperature and Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Package and Mounting  484-FBGA (484-UBGA, 19×19) surface-mount package for compact board-level integration.
• Standards and Compliance  RoHS-compliant construction.

Typical Applications

• Industrial Control  Programmable control logic, motor drives and sensor aggregation leveraging the device’s large logic capacity and industrial temperature range.
• Wireless and Wireline Infrastructure  Frontend or mid-tier processing where high I/O count and family-level high-speed interfaces enable protocol handling and data formatting.
• Military and Defense Systems  Signal processing, data multiplexing and interface bridging in temperature-challenging environments using the industrial-grade package and operating range.

Unique Advantages

• High-density programmable fabric: Approximately 301,000 logic elements provide headroom for large state machines, protocol stacks and custom accelerators.
• Significant on-chip memory: Roughly 14.25 Mbits of embedded RAM reduces the need for external buffering and simplifies board-level memory architecture.
• Broad I/O capability: 240 I/Os support multiple parallel interfaces and mixed-signal front ends without extensive external multiplexing.
• Industrial thermal range: Rated from −40 °C to 100 °C for reliable operation in harsh or temperature-variable installations.
• Compact BGA packaging: 484-ball FBGA (19×19) offers a dense footprint for space-constrained boards while enabling surface-mount assembly.
• Family-proven system IP: Cyclone V documentation highlights integrated transceivers and hard memory controllers at the device-family level, enabling high-bandwidth system designs where those options are applicable.

Why Choose 5CGXFC9A6U19I7N?

5CGXFC9A6U19I7N positions itself as a robust, industrial-grade Cyclone V GX option when designers need substantial programmable logic, meaningful on-chip memory and a high I/O count in a compact FBGA package. The specified core supply range and wide operating temperature make it suitable for embedded systems deployed in challenging environments.

Engineers designing industrial automation, wireless/wireline infrastructure or defense systems will find the combination of density, embedded memory and family-level hard IP capabilities helpful for reducing external components and accelerating time-to-market while remaining within a predictable power and thermal envelope.

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