5CGXFC9C6F23I7N

The 5CGXFC9C6F23I7N is an Intel Cyclone V GX field-programmable gate array (FPGA) in a 484-BGA package designed for industrial applications. It combines a high logic capacity with substantial embedded memory and a broad I/O count to address bandwidth‑oriented, cost-sensitive designs in industrial, wireless/wireline, and military markets.

Built on the Cyclone V architecture, this device targets designs that require dense programmable logic, on‑chip RAM, and reliable operation across an extended temperature range while operating from a tightly controlled core supply.

Key Features

• Logic Capacity — 301,000 logic elements, providing substantial programmable fabric for complex logic and control functions.
• Embedded Memory — Approximately 14.25 Mbits of on‑chip RAM, enabling large on‑chip data storage and buffering for high-throughput designs.
• I/O and Packaging — 224 user I/O in a 484‑FBGA (23×23) form factor, surface‑mount package for high‑density board integration.
• Core Voltage — Narrow supply window of 1.07 V to 1.13 V (nominal 1.1 V), aligning with the Cyclone V low‑power core requirements.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial and rugged environments.
• Process and Architecture — Part of the Cyclone V family built on TSMC 28‑nm low‑power (28LP) process with enhanced 8‑input adaptive logic modules and M10K memory blocks with ECC (series features).
• Integrated Interfaces — Cyclone V GX devices include integrated transceivers and hard memory controller features (series capabilities), supporting higher bandwidth system designs.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control Systems — Use the device for motor control, PLC logic, and factory automation where high logic density and industrial temperature operation are required.
• Wireless and Wireline Infrastructure — Deploy in bandwidth‑oriented line cards, protocol bridges, and datapath acceleration leveraging the Cyclone V GX transceiver and memory features.
• Military and Ruggedized Electronics — Suitable for mission equipment and rugged embedded systems that benefit from extended temperature range and high I/O count.

Unique Advantages

• High Logic and Memory Integration: 301,000 logic elements together with approximately 14.25 Mbits of embedded RAM reduce external memory needs and simplify board design.
• Tight Core Voltage Window: The specified 1.07–1.13 V supply supports predictable power design and aligns with the Cyclone V low‑power core architecture.
• Industrial Temperature Capability: −40 °C to 100 °C rating enables deployment in demanding environments without derating logic capability.
• Dense I/O in a Compact Package: 224 I/O in a 23×23 484‑FBGA (surface mount) provides high pin density for complex system interfaces while minimizing PCB footprint.
• Series-Level Architecture Benefits: Leverages Cyclone V family features such as enhanced ALMs, M10K memory blocks with ECC, and integrated transceivers/hard memory controllers to address bandwidth and reliability needs.
• Regulatory Compliance: RoHS compliance supports global manufacturing and sourcing requirements.

Why Choose 5CGXFC9C6F23I7N?

This Cyclone V GX device is positioned for designers who need a balance of high programmable logic density, substantial embedded memory, and a robust industrial temperature range. The combination of 301,000 logic elements, approximately 14.25 Mbits of on‑chip RAM, and 224 I/O pins in a 484‑FBGA package supports complex control, data‑path, and interface functions while keeping board area and external component count low.

For engineering teams targeting industrial, wireless/wireline, or military systems that require reliable operation across extended temperatures and tight power rails, the 5CGXFC9C6F23I7N provides a Cyclone V‑class FPGA platform with the integration and determinism needed for production designs.

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