5CGXFC9D6F27C7N

The 5CGXFC9D6F27C7N is an Intel Cyclone® V GX field-programmable gate array supplied in a 672-ball FBGA (27 × 27) package. It delivers 301,000 logic elements and approximately 14.25 Mbits of embedded memory in a commercial-grade, surface-mount device intended for high-volume, cost-sensitive designs that benefit from integrated transceivers and on-chip memory resources.

Designed around a low-voltage core (nominal 1.1 V, supported supply 1.07 V to 1.13 V) and a commercial operating range of 0 °C to 85 °C, this device targets applications requiring dense logic, sizable embedded RAM, and numerous I/O in a compact package.

Key Features

• Core Logic — 301,000 logic elements provide a large programmable fabric for complex control, signal processing, and glue-logic tasks.
• Embedded Memory — Approximately 14.25 Mbits of on-chip RAM (14,251,008 bits) to support buffer caches, FIFOs, and local storage.
• I/O Density — 336 user I/O pins for high pin-count interfacing with peripherals, memory chips, and system-level signals.
• Transceiver & IP Integration — Cyclone V GX family features integrated high-speed transceiver and hard memory-controller capabilities as part of the device family architecture.
• Package & Mounting — 672-FBGA (27 × 27) surface-mount package for compact board-level integration.
• Power — Low-voltage core operation with a specified supply range of 1.07 V to 1.13 V consistent with 1.1 V nominal operation.
• Temperature & Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Regulatory — RoHS compliant.

Typical Applications

• Telecommunications & Networking — Use the device’s high logic density and embedded memory for packet buffering, protocol offload, and interface bridging in cost-sensitive network equipment.
• Wireless and Wireline Systems — Integrate transceiver-capable fabric and on-chip memory for data path functions, framing, and interface control.
• Embedded Control — Implement high-channel-count control logic, sensor aggregation, and real-time processing for complex embedded systems.
• High-density I/O Applications — Leverage 336 I/O pins to aggregate multiple peripherals, memory interfaces, and board-level buses in a single device.

Unique Advantages

• High Logic Capacity: 301,000 logic elements enable consolidation of multiple functions and reduce external glue logic.
• Substantial On-chip RAM: Approximately 14.25 Mbits of embedded memory supports local buffering and reduces dependency on external memory for many designs.
• Compact, High-pin Package: 672-FBGA (27 × 27) delivers high I/O density in a compact footprint for space-constrained PCBs.
• Low-voltage Operation: Narrow core supply range (1.07 V–1.13 V) aligns with low-power system architectures and predictable power budgeting.
• RoHS Compliance: Meets lead-free manufacturing requirements for modern production environments.

Why Choose 5CGXFC9D6F27C7N?

The 5CGXFC9D6F27C7N provides a balanced combination of large logic capacity, significant on-chip RAM, and broad I/O in a compact 672-FBGA package. Its low-voltage core and Cyclone V GX family architecture make it well suited to designers who need to integrate multiple functions and high-speed interfaces while controlling system cost and board real estate.

This device is ideal for engineering teams developing high-volume, cost-sensitive products that require robust programmable logic, embedded memory resources, and a dense I/O footprint, backed by the Cyclone V series architecture.

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