5CGXFC9E6F31C7N

The 5CGXFC9E6F31C7N is a Cyclone® V GX family FPGA packaged in a 896-ball BGA (896-FBGA, 31 × 31) in a surface-mount form factor. It combines a high-density programmable fabric with substantial on-chip RAM and a broad I/O count for designs that require large logic capacity, significant embedded memory, and flexible high-speed I/O.

Targeted at applications that demand integration of logic, memory and high-speed serial interfaces, this commercial-grade device delivers 301,000 logic elements, approximately 14.25 Mbits of embedded memory, and 480 general-purpose I/Os, while operating from a 1.07 V to 1.13 V core supply and across a 0 °C to 85 °C temperature range.

Key Features

• Core logic  301,000 logic elements implemented with enhanced adaptive logic modules (ALMs) for efficient logic packing and register usage.
• Embedded memory  Approximately 14.25 Mbits of on-chip RAM organized in M10K memory blocks with soft error correction code (ECC) support for robust storage of intermediate data and buffers.
• DSP and processing  Variable-precision DSP blocks for fixed- and floating-point signal processing; family documentation includes options for a hard processor system (HPS) with integrated Arm Cortex‑A9 for system-on-chip designs.
• I/O and high-speed serial  480 device I/Os plus integrated transceivers supporting high-speed serial rates (including 3.125 Gbps and 6.144 Gbps as documented for the Cyclone V family) for demanding communication links.
• External memory and IP  Hard memory controllers and PCIe Gen1/Gen2 hard IP are available on the Cyclone V family for efficient external memory and host-interface integration.
• Power  Designed on a TSMC 28-nm low-power process with a nominal core voltage near 1.1 V; operating supply window specified at 1.07 V to 1.13 V for core power planning.
• Package, mounting and environmental  896-ball FBGA (31 × 31) surface-mount package; commercial grade operation from 0 °C to 85 °C and RoHS-compliant.

Typical Applications

• Wireless and wireline communications  Use the integrated high-speed transceivers and large programmable fabric for baseband processing, protocol offload, and packet handling in wired and wireless systems.
• High-bandwidth embedded systems  Leverage the large logic capacity, ample on-chip RAM, and hard memory controllers for data buffering, DMA acceleration, and custom processing pipelines.
• Defense and aerospace systems  Employ the device’s combination of logic density, embedded memory, and high-speed I/O for processing and I/O aggregation in mission systems where Cyclone V family devices are documented for such applications.
• SoC integration  Architectures that combine FPGA fabric with an HPS (as documented for the Cyclone V family) can consolidate processor and custom logic tasks in a single silicon footprint.

Unique Advantages

• High logic density: 301,000 logic elements enable complex state machines, acceleration engines, and wide datapaths without external glue logic.
• Substantial on-chip RAM: Approximately 14.25 Mbits of embedded memory organized in M10K blocks supports large buffers, caches, and parameter storage with ECC options.
• Extensive I/O and serial capability: 480 I/Os combined with documented high-speed transceivers provide flexible interfacing to peripherals and high-throughput links.
• Low-voltage operation: Narrow core supply range (1.07–1.13 V) supports low-power design strategies and predictable power budgeting.
• Scalable SoC options: Cyclone V family documentation includes a hard processor system (HPS) option for tighter processor–FPGA integration when required by the design.
• Commercial and RoHS-compliant package: Surface-mount 896-FBGA packaging and RoHS compliance simplify assembly and environmental compliance for commercial products.

Why Choose 5CGXFC9E6F31C7N?

The 5CGXFC9E6F31C7N delivers a balanced combination of logic capacity, embedded memory, and high-speed I/O in a commercial-grade Cyclone V GX device. Its 301,000 logic elements and approximately 14.25 Mbits of RAM support complex custom logic and buffering requirements, while integrated transceivers and hard IP simplify high-bandwidth interface implementation.

This device is suitable for engineering teams building high-throughput embedded systems, communications equipment, or SoC-class designs that require substantial on-chip resources, predictable low-voltage operation, and a compact 896-FBGA package. Its family-level support for processor integration and hard memory controllers helps reduce board-level complexity and long-term BOM cost.

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