5CGXFC9E6F35C7N

The 5CGXFC9E6F35C7N is an Intel Cyclone® V GX field-programmable gate array (FPGA) in a 1152-ball BGA package. It combines a high logic capacity and substantial embedded memory with a large I/O count to address high-volume, cost-sensitive designs that require flexible, reconfigurable logic.

Built on the Cyclone V device family architecture, this device offers features targeted at systems requiring integrated FPGA fabric, embedded memory, and scalable I/O in a compact surface-mount package.

Key Features

• Logic Capacity — 301,000 logic elements to implement complex custom logic and control functions.
• Embedded Memory — Approximately 14.25 Mbits of on-chip RAM (14,251,008 bits) for buffering, packet processing, and on-chip data storage.
• I/O Density — 560 user I/O pins to support broad external interface options and parallel connectivity.
• Process and Core Voltage — Cyclone V architecture built on TSMC 28 nm low-power process with a core supply range of 1.07 V to 1.13 V (nominal ~1.1 V).
• FPGA Architecture Highlights — Series-level features include an enhanced 8-input adaptive logic module (ALM), variable-precision DSP blocks, M10K embedded memory blocks with ECC, and integrated transceiver and memory-controller hard IP (as documented for Cyclone V devices).
• Package and Mounting — Surface-mount 1152-FBGA (35 × 35 mm) package for compact PCB layout and high pin density.
• Operating Range — Commercial-grade temperature range 0 °C to 85 °C.
• Regulatory/Compliance — RoHS-compliant.

Typical Applications

• High-bandwidth communications — Use the device’s high logic density and series-level transceiver and memory-controller IP to implement packet processing, protocol bridging, and interface glue logic.
• Embedded processing and acceleration — Deploy FPGA fabric and DSP blocks for hardware acceleration of compute-intensive functions and real-time signal processing.
• Memory-intensive interfaces — Leverage on-chip embedded memory and documented hard memory-controller features for buffering and external-memory interface control.
• System and board-level glue logic — Large I/O count and flexible logic resources make the device suited for consolidating multiple peripheral interfaces and custom control logic.

Unique Advantages

• High logic and memory density: 301,000 logic elements and approximately 14.25 Mbits of embedded RAM support complex designs without immediate external memory dependency.
• Extensive I/O capacity: 560 I/Os enable broad connectivity and integration of multiple peripherals and high-pin-count interfaces.
• Low-voltage core operation: Narrow core supply range around 1.1 V (1.07–1.13 V) aligns with low-power design strategies for reduced power consumption.
• Compact, high-density package: 1152-FBGA (35 × 35 mm) provides a small footprint for high-performance, space-constrained PCBs.
• Series-level architectural benefits: Cyclone V features such as 8-input ALMs, variable-precision DSP blocks, and M10K memory blocks with ECC offer architectural building blocks for performance and reliability.
• RoHS-compliant: Conforms to lead-free manufacturing requirements for regulatory compliance.

Why Choose 5CGXFC9E6F35C7N?

The 5CGXFC9E6F35C7N delivers a blend of high logic capacity, substantial embedded memory, and broad I/O in a compact surface-mount 1152-FBGA package. Its Cyclone V GX lineage brings architectural elements (ALMs, DSP blocks, embedded memory blocks, and hard IP) that help reduce external component count and streamline system integration.

This device is well suited to engineering teams and OEMs designing high-volume, cost-sensitive hardware that requires flexible on-board programmability, significant on-chip buffering and processing, and a compact board footprint—backed by the Cyclone V device family’s documented features and optimizations.

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