5CGXFC9E6F35I7N

The 5CGXFC9E6F35I7N is an Intel Cyclone® V GX field-programmable gate array (FPGA) in a 1152-BGA (1152-FBGA, 35×35) package. It delivers a high logic count and substantial embedded memory for system integration in industrial and communications-oriented designs.

Key attributes exposed in the data include approximately 301,000 logic elements, about 14.25 Mbits of embedded RAM, 560 I/O pins, a narrow core supply range (1.07 V–1.13 V), and an industrial operating range from -40 °C to 100 °C. The device is RoHS compliant and supplied in a surface-mount BGA package.

Key Features

• Logic Capacity  Approximately 301,000 logic elements to implement complex programmable logic, custom state machines, and glue-logic functions.
• Embedded Memory  Approximately 14.25 Mbits of on-chip RAM for data buffering, packet queues, FIFOs, and on-chip storage.
• I/O Density & Package  560 user I/O pins in a 1152-BGA (1152-FBGA, 35×35) footprint, enabling dense board-level connectivity and multi-bank signal routing.
• Power Supply  Tight core voltage window of 1.07 V to 1.13 V to support consistent power design and core rail stability.
• Temperature & Grade  Industrial-grade device rated for -40 °C to 100 °C operation to meet extended-environment deployments.
• Mounting & Compliance  Surface-mount BGA package for automated assembly; RoHS compliant for restricted-substance requirements.

Typical Applications

• Industrial Control and Automation  High logic count and extended temperature range suit motor control, PLC functions, and deterministic I/O interfacing in industrial systems.
• Wireless and Wireline Infrastructure  Embedded memory and high I/O density support packet buffering, protocol bridging, and interface logic in communications equipment.
• High-Density Embedded Systems  The 1152-FBGA package and 560 I/Os enable compact board layouts where multiple high-speed interfaces and rich pinouts are required.
• Defense and Ruggedized Electronics  Industrial-grade temperature rating and programmable logic flexibility make the device suitable for military-oriented processing and custom signal processing blocks.

Unique Advantages

• Substantial Logic Resources:  Approximately 301,000 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing external components.
• Significant On-Chip RAM:  About 14.25 Mbits of embedded memory supports on-chip buffering and local data storage to improve system throughput.
• High I/O Count in Compact Package:  560 I/Os in a 1152-FBGA (35×35) allow flexible partitioning of interfaces without increasing PCB footprint.
• Industrial Temperature Rating:  -40 °C to 100 °C operating range supports deployments in harsh and temperature-variable environments.
• Controlled Core Power Requirement:  The narrow 1.07 V–1.13 V supply window simplifies core power budgeting and voltage-rail design.
• RoHS Compliance:  Meets restricted-substance requirements for modern manufacturing and regulatory needs.

Why Choose 5CGXFC9E6F35I7N?

The 5CGXFC9E6F35I7N combines a high logic element count, substantial embedded memory, and a large I/O complement in a compact 1152-FBGA package, making it a strong candidate for systems that demand integration and deterministic performance in industrial and communications environments. Its industrial temperature rating and narrow core-voltage range support reliable deployment in extended-temperature applications while simplifying power design.

This Cyclone® V GX device is suited for engineering teams designing high-density embedded systems, communications interfaces, and industrial control platforms that require a balance of logic capacity, on-chip memory, and board-level I/O connectivity backed by Intel's Cyclone V device family documentation.

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