5SEE9F45C2G

The 5SEE9F45C2G is a Stratix® V E family FPGA from Intel, offered as a commercial-grade, surface-mount FCBGA device. It delivers a high-density programmable logic resource set and on-chip memory in a 1932-ball FCBGA (45 × 45 mm) package intended for complex digital designs.

Key on-chip resources include 840,000 logic elements and approximately 53 Mbits of embedded memory, plus 840 user I/O pins. The device operates from a core supply range of 870 mV to 930 mV and is specified for commercial operating temperatures (0 °C to 85 °C).

Key Features

• Core / Family Stratix V E FPGA architecture provided in a commercial temperature grade with device-level electrical characteristics documented in the Stratix V device datasheet.
• Logic Density 840,000 logic elements for implementing large-scale programmable logic functions and custom hardware accelerators.
• Embedded Memory Approximately 53 Mbits of on-chip RAM to support buffering, large state machines, and on-die data storage.
• I/O Capability 840 user I/O pins to interface with high-pin-count systems and external peripherals.
• Power Core voltage supply range of 870 mV to 930 mV for the device core power domain.
• Package & Mounting 1932-ball BGA package (supplier device package: 1932-FBGA, FC (45×45)), surface-mount mounting type for dense PCB integration.
• Operating Temperature Commercial grade rated for 0 °C to 85 °C ambient operation.
• Compliance RoHS-compliant manufacturing status.

Typical Applications

• High-density logic implementation — Suitable for designs requiring up to 840,000 logic elements to realize complex custom digital functions.
• On-chip data buffering and shared memory — Approximately 53 Mbits of embedded RAM supports large buffers, packet storage, and state memory.
• High-pin-count system interfaces — 840 I/O pins accommodate multi-channel external connectivity and parallel interfaces.

Unique Advantages

• Substantial logic resources: 840,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Large embedded memory footprint: Approximately 53 Mbits of on-chip RAM minimizes the need for external memory in many designs, simplifying layout and timing.
• Extensive I/O availability: 840 user I/Os provide flexibility for interfacing to a wide range of peripherals and high-bandwidth signals.
• Compact, manufacturable package: 1932-ball FCBGA (45 × 45 mm) surface-mount package supports high-density PCB assembly workflows.
• Commercial temperature grade: Specified for 0 °C to 85 °C operation to match commercial embedded and enterprise environments.
• RoHS compliant: Meets lead-free and restricted substances manufacturing requirements.

Why Choose 5SEE9F45C2G?

The 5SEE9F45C2G combines high logic density, substantial on-chip memory, and a large I/O count in a single commercial-grade Stratix V E FPGA package. This device is positioned for designs that require dense programmable logic, significant embedded RAM, and flexible external interfacing while maintaining standard surface-mount assembly and commercial temperature operation.

Designed and documented within the Stratix V device family, the 5SEE9F45C2G is suitable for engineering teams seeking a high-capacity FPGA solution with clear electrical parameters (core voltage 870–930 mV) and packaging details for system-level integration.

Request a quote or submit a purchase inquiry to begin evaluating 5SEE9F45C2G for your next high-density FPGA design.