5SEE9F45C2LG

The 5SEE9F45C2LG is a Stratix® V E family FPGA device offering high programmable logic capacity and extensive on-chip memory in a high-pin-count FCBGA package. It provides a large number of user I/O and a low-voltage core range to support high-density system designs.

This device is well suited for designs that require substantial logic resources, large embedded RAM, and broad I/O connectivity—enabling complex algorithms, data buffering, and system-level integration within a commercial temperature operating window.

Key Features

• Logic Capacity  Approximately 840,000 logic elements, delivering significant programmable resources for complex designs.
• Embedded Memory  Approximately 53.25 Mbits of embedded memory (53,248,000 bits) for large on-chip buffering and state storage.
• I/O Resources  Up to 840 user I/O pins to support wide parallel interfaces and extensive external connectivity.
• Package & Mounting  1932-BBGA FCBGA package (supplier package: 1932-FBGA, FC 45×45) in a surface-mount form factor for high-density PCB integration.
• Power Supply  Core voltage range specified from 820 mV to 880 mV, enabling defined low-voltage core operation.
• Operating Grade & Temperature  Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS-compliant for conformity with environmental regulations.
• Manufacturer Documentation  Detailed electrical and switching characteristics are provided by the manufacturer’s Stratix V device datasheet for system-level design and verification.

Typical Applications

• High-density logic implementations  Large programmable resource count supports complex state machines, custom datapaths, and algorithm acceleration.
• Memory-intensive functions  Substantial on-chip RAM for buffering, packet storage, and intermediate data retention in streaming systems.
• Wide parallel and high-pin-count interfaces  Up to 840 I/O pins accommodate broad bus interfaces, multiple peripherals, and extensive external connectivity.
• System integration and prototyping  FCBGA package and surface-mount mounting allow compact board-level designs and integration in dense assemblies.

Unique Advantages

• High programmable density: 840,000 logic elements provide the capacity to implement complex designs without immediate partitioning across multiple devices.
• Large embedded RAM: Approximately 53.25 Mbits of on-chip memory reduces reliance on external RAM for many buffering and storage tasks.
• Extensive I/O footprint: 840 I/O pins simplify connectivity to numerous peripherals, sensors, and external interfaces.
• Compact, high-pin-count package: 1932-ball FCBGA (45×45 mm footprint) balances board density with connectivity for system-level integration.
• Defined commercial operating range: Commercial grade and 0 °C to 85 °C operating temperature support standard commercial deployments.
• Regulatory readiness: RoHS compliance supports environmentally regulated product builds.

Why Choose 5SEE9F45C2LG?

The 5SEE9F45C2LG delivers a mix of high logic capacity, substantial embedded memory, and broad I/O in a compact FCBGA package—making it a practical choice for engineers designing dense, capability-rich FPGA-based systems. Its commercial-grade rating and clearly specified electrical parameters help simplify system power and thermal planning.

Choose this device when your design requires significant on-chip resources and a large I/O count for tight system integration, while relying on manufacturer-provided datasheet details for electrical and switching characteristics.

Request a quote or submit a design inquiry to evaluate 5SEE9F45C2LG for your next FPGA-based project.