5SEE9F45C3N

The 5SEE9F45C3N is an Intel Stratix V E family FPGA delivered in a 1932-ball FCBGA package for surface-mount applications. Built on the Stratix V family architecture, this device emphasizes very high logic density and on-chip memory for demanding compute and emulation tasks.

Targeted use cases include ASIC and system emulation, diagnostic imaging, and instrumentation where a large number of logic elements, abundant embedded memory, and a high I/O count enable complex, high-capacity designs.

Key Features

• Core and architecture — Based on the Stratix V family 28‑nm architecture with an enhanced core design; optimized for high logic density and complex fabric implementations.
• Logic capacity — 840,000 logic elements to implement large-scale logic, control, and processing functions within a single device.
• Embedded memory — Approximately 53.25 Mbits of on‑chip RAM, implemented with 20 Kbit (M20K) memory blocks for large buffering and data storage.
• I/O resources — 840 user I/Os to support wide external interfacing and parallel connectivity.
• Power — Core supply range specified at 820 mV to 880 mV to match system power planning and regulator selection.
• Package and mounting — 1932‑BBGA (FCBGA) package, supplier package 1932‑FBGA, FC (45×45); surface-mount mounting for board-level integration.
• Operating range and grade — Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental compliance — RoHS compliant.

Typical Applications

• ASIC and system emulation — High logic density and large embedded RAM make this FPGA suitable for prototyping and emulation of complex ASIC designs.
• Diagnostic imaging — On-chip memory and abundant logic elements support image processing pipelines and buffering tasks in diagnostic equipment.
• Instrumentation — High I/O count and dense logic enable multi-channel data acquisition, control logic, and real-time processing in measurement systems.

Unique Advantages

• Very high logic capacity: 840,000 logic elements provide the scale needed for large, multi-function designs without partitioning across multiple FPGAs.
• Significant on‑chip memory: Approximately 53.25 Mbits of embedded RAM reduces dependence on external memory for buffering and intermediate data storage.
• Large I/O complement: 840 I/Os allow broad connectivity to peripherals, sensors, and high-channel-count front-ends.
• Compact, high-density packaging: 1932-ball FCBGA (45×45) enables a small board footprint for high-performance systems.
• Commercial temperature and RoHS compliance: Commercial-grade 0 °C to 85 °C operation and RoHS compliance support mainstream electronics production and regulatory requirements.
• Low-voltage core operation: Core supply specified at 820–880 mV supports modern, efficient power-rail design.

Why Choose 5SEE9F45C3N?

The 5SEE9F45C3N is positioned for designs that demand large programmable logic capacity combined with substantial on‑chip memory and high I/O density. Its Stratix V family architecture provides the building blocks—advanced logic, M20K memory blocks, and a fabric suited to high-capacity designs—needed for emulation, imaging, and instrumentation workloads.

For engineering teams and procurement seeking a single-device solution to reduce board complexity and keep signal routing local, this FPGA delivers a balance of logic, memory, and connectivity in a compact FCBGA package with commercial-temperature operation and RoHS compliance.

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