5SEE9F45I2G

The 5SEE9F45I2G is an Intel Stratix® V E Field Programmable Gate Array (FPGA) packaged in a 1932-BBGA (FCBGA) format. It provides a high-density programmable fabric with substantial on-chip memory and a large I/O count for complex, logic- and memory-intensive designs.

Designed for industrial-grade deployments, this device combines up to 840,000 logic elements, approximately 53.248 Mbits of embedded memory, and 840 user I/O pins in a surface-mount, 1932-ball FCBGA package.

Key Features

• Core Logic Capacity  Up to 840,000 logic elements for high-density programmable logic and complex implementable functions.
• Embedded Memory  Approximately 53.248 Mbits of on-chip RAM to support large buffering, state storage, and data processing tasks.
• I/O Density  840 I/O pins to interface with high-channel-count peripherals, buses, and external memory systems.
• Power Supply  Core voltage range specified from 870 mV to 930 mV for validated operating conditions.
• Thermal & Temperature Rating  Industrial-grade operation with an ambient range of −40 °C to 100 °C for robust system deployment.
• Package & Mounting  1932-BBGA (FCBGA) package; supplier package listed as 1932-FBGA, FC (45×45). Surface-mount device for standard PCB assembly.
• Regulatory Compliance  RoHS-compliant component suitable for lead-free manufacturing processes.

Typical Applications

• High-density logic designs  Implement large, complex logic functions using up to 840,000 logic elements and extensive embedded RAM.
• I/O-intensive systems  Support wide parallel interfaces and multiple peripherals with 840 available I/O pins.
• Industrial equipment  Suitable for industrial-grade systems that require operation across −40 °C to 100 °C.
• Memory-heavy processing  Leverage approximately 53.248 Mbits of on-chip RAM for buffering, packet processing, or data staging.

Unique Advantages

• High logic density: 840,000 logic elements enable consolidation of complex functions into a single programmable device, reducing system BOM.
• Substantial on-chip RAM: Approximately 53.248 Mbits of embedded memory minimizes external memory dependence and simplifies timing closure.
• Extensive I/O headroom: 840 I/O pins accommodate multi-channel interfaces and large peripheral sets without external I/O expansion.
• Industrial thermal range: Rated from −40 °C to 100 °C to meet the environmental needs of industrial applications.
• Compact package for dense boards: 1932-BBGA (45×45) FCBGA package provides high I/O and logic density in a surface-mount form factor.
• RoHS compliance: Supports lead-free manufacturing and regulatory requirements for modern production.

Why Choose 5SEE9F45I2G?

The 5SEE9F45I2G positions itself for designs that demand a combination of very high logic capacity, significant embedded memory, and broad I/O connectivity in an industrial-grade FPGA. Its defined core voltage range and temperature rating make it suitable for robust deployments where stability and predictable electrical characteristics are required.

This device is appropriate for development teams and system integrators who need to consolidate complex functionality into a single programmable device, reduce external component count, and support designs that operate across a wide temperature range.

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