5SEE9F45I2LG
| Part Description |
Stratix® V E Field Programmable Gate Array (FPGA) IC 840 53248000 840000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 2,000 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 317000 | Number of Logic Elements/Cells | 840000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SEE9F45I2LG – Stratix® V E Field Programmable Gate Array (FPGA) IC
The 5SEE9F45I2LG is a Stratix® V E family FPGA in a high-density FCBGA package, offered in an industrial temperature grade. It combines a large programmable logic fabric with substantial on-chip memory and extensive I/O capability for complex, I/O‑rich designs.
Engineered for applications that require significant logic capacity, embedded RAM, and broad I/O counts, this device delivers integration and configurability while operating across an industrial temperature range.
Key Features
- Logic Capacity Approximately 840,000 logic elements, enabling large-scale programmable logic implementations.
- Embedded Memory Approximately 53 Mbits of on‑chip RAM for distributed storage, buffering, and state machines.
- I/O Density Up to 840 user I/O pins to interface with numerous peripherals, buses, and high‑pin‑count systems.
- Power and Core Voltage Core supply operating range from 820 mV to 880 mV to support the device’s internal logic power requirements.
- Package & Mounting 1932‑BBGA FCBGA package (supplier device package listed as 1932‑FBGA, FC (45×45)); surface‑mount device for standard PCB assembly.
- Temperature Range Industrial operating range from −40 °C to 100 °C for deployment in temperature‑challenging environments.
- Compliance RoHS compliant.
Typical Applications
- Industrial control systems Large logic capacity and industrial temperature rating make it suitable for PLCs, motion control, and factory automation where robust operation is required.
- High‑density interface hubs Extensive I/O and embedded RAM support bridging, protocol aggregation, and custom interface logic for communications and instrumentation equipment.
- Data buffering and preprocessing Significant on‑chip RAM allows local data storage and preprocessing in embedded systems and data acquisition nodes.
Unique Advantages
- Substantial programmable fabric Approximately 840,000 logic elements provide the capacity to consolidate multiple functions into a single device, reducing system complexity.
- Large on‑chip memory Around 53 Mbits of embedded RAM enable efficient local buffering and state storage without relying solely on external memory.
- Extensive I/O headroom Up to 840 I/O pins let you connect numerous peripherals and high‑pin‑count interfaces directly to the FPGA.
- Industrial temperature support Rated for −40 °C to 100 °C to meet the thermal requirements of demanding operational environments.
- Surface‑mount, high‑pin package 1932‑BBGA FCBGA packaging provides a high I/O density solution compatible with standard PCB assembly processes.
- Regulatory readiness RoHS compliance for environmental and manufacturing considerations.
Why Choose 5SEE9F45I2LG?
5SEE9F45I2LG positions itself as a high‑density Stratix V E FPGA suitable for designs that need large programmable logic capacity, substantial embedded memory, and extensive I/O, all in an industrial‑rated package. The combination of ~840k logic elements, ~53 Mbits of on‑chip RAM, and 840 I/O pins supports consolidation of complex functions and reduces system bill‑of‑materials.
This device is well suited for engineering teams building industrial controls, interface hubs, and embedded systems that require robust thermal tolerance, surface‑mount packaging, and verifiable electrical characteristics defined by the Stratix V family datasheet.
Request a quote or submit an inquiry for 5SEE9F45I2LG to obtain pricing, availability, and ordering information from your preferred supplier.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018