5SEE9F45I3G

The 5SEE9F45I3G is a Stratix® V E Field Programmable Gate Array (FPGA) IC designed for high-density programmable logic applications. It delivers a large logic fabric and substantial embedded memory capacity combined with a high pin count and an industrial temperature grade for robust deployment.

Targeted at designs requiring large-scale logic integration and extensive on-chip RAM, this device provides a combination of 840,000 logic elements, approximately 53.25 Mbits of embedded memory, and 840 user I/Os in a 1932-ball FCBGA package.

Key Features

• Core Logic Capacity 840,000 logic elements (cells) to implement complex programmable logic and large-scale logic functions.
• Embedded Memory Approximately 53.25 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O Density 840 user I/Os to support high pin-count interfacing and dense external connectivity.
• Power Supply Core voltage range of 820 mV to 880 mV to match system power-rail requirements specified for this device.
• Package & Mounting 1932-BBGA (supplier package: 1932-FBGA, FC 45×45) in a surface-mount FCBGA form factor for compact board integration.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C to meet extended temperature requirements for industrial environments.
• RoHS Compliant Meets RoHS environmental compliance as specified in the product data.

Typical Applications

• High-density signal processing — Large logic capacity and substantial on-chip RAM enable implementation of complex real-time processing pipelines.
• Platform consolidation — High I/O count and logic density support integrating multiple system functions into a single FPGA.
• Industrial control and automation — Industrial-grade temperature range and robust packaging suit embedded control systems operating across wide temperatures.

Unique Advantages

• Significant logic resources: 840,000 logic elements provide the capacity needed for large, partitioned designs and dense RTL implementations.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• High I/O count: 840 user I/Os enable extensive peripheral connectivity and flexible system interfacing without immediate external multiplexing.
• Industrial-ready thermal range: Operation from −40 °C to 100 °C supports deployments in temperature-challenging environments.
• Compact, serviceable package: 1932-ball FCBGA surface-mount package offers a dense form factor suitable for space-constrained boards.
• Regulatory compliance: RoHS status indicates alignment with common environmental requirements.

Why Choose 5SEE9F45I3G?

The 5SEE9F45I3G combines very high logic density, substantial embedded memory, and a large I/O complement in a single Stratix® V E FPGA device. Its industrial temperature rating and compact 1932‑ball FCBGA package make it suitable for demanding embedded and industrial systems that require integration of complex logic and local data storage.

This device is well suited for engineering teams designing high-capacity, scalable FPGA solutions where on-chip resources and reliable temperature performance are key selection criteria.

Request a quote or submit a product inquiry to evaluate 5SEE9F45I3G for your next high-density FPGA design project.