5SEE9F45I3N

The 5SEE9F45I3N is an Intel Stratix® V E Field Programmable Gate Array supplied in a 1932-BBGA FCBGA package for surface-mount applications. It combines high logic capacity, substantial embedded RAM, and a large I/O count for designs that require dense integration and extensive on-chip resources.

With 840,000 logic elements and approximately 53.248 Mbits of embedded memory, this industrial-grade device targets designs that need high logic density, significant on-chip storage, and broad I/O capability while operating across –40 °C to 100 °C and a core voltage range of 820 mV to 880 mV.

Key Features

• Logic Capacity  Provides 840,000 logic elements to implement complex state machines, datapaths, and custom compute logic directly on-chip.
• Embedded Memory  Approximately 53.248 Mbits of on-chip RAM to support buffering, large lookup tables, and local storage for high-throughput designs.
• I/O Density  840 user I/Os enable wide parallel interfaces and high-pin-count connectivity for peripheral devices and board-level integration.
• Power and Core Supply  Core operating voltage range from 820 mV to 880 mV for designs targeting the specified Stratix V E operating conditions.
• Package and Mounting  1932-BBGA (FCBGA) package in a 45×45 mm supplier device package, designed for surface-mount assembly on standard PCB processes.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C to meet a wide range of environmental requirements.

Typical Applications

• High-density compute and acceleration  Use the large logic element count and embedded RAM to implement custom accelerators and datapath-heavy functions.
• Data buffering and packet processing  Approximately 53.248 Mbits of on-chip memory supports buffering and state storage for networking or streaming applications.
• Wide parallel I/O systems  840 I/Os allow broad interfacing to high-channel-count peripherals, sensors, and parallel buses.
• Industrial control and communication systems  Industrial temperature rating and high I/O density suit control platforms and communications equipment requiring robust operation.

Unique Advantages

• High on-chip integration: 840,000 logic elements and substantial embedded RAM reduce external component count and simplify board-level designs.
• Broad I/O capability: 840 user I/Os provide the flexibility to connect numerous peripherals or implement wide data buses without multiplexing compromises.
• Industrial operating range: Rated for –40 °C to 100 °C operation, supporting deployments in environments requiring extended temperature performance.
• Compact FCBGA package: 1932-BBGA (45×45 mm) package supports high-density PCB layouts while enabling surface-mount assembly.
• Defined core supply window: The 820 mV–880 mV voltage range clarifies power delivery and sequencing requirements for system design.

Why Choose 5SEE9F45I3N?

The 5SEE9F45I3N targets designs that require a combination of high logic density, significant embedded memory, and large I/O counts in an industrial-temperature FPGA. Its specification set makes it suitable for engineers building complex, memory- and I/O-intensive systems who need a predictable power envelope and a compact BGA footprint.

Choosing this Stratix V E device supports scalable, robust designs where on-chip resources reduce BOM and simplify timing closure, while the industrial temperature rating and surface-mount FCBGA package support a wide range of deployment environments and assembly processes.

Request a quote or submit a pricing inquiry for part number 5SEE9F45I3N to receive availability and ordering information.