5SEE9F45I4G

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V E Field Programmable Gate Array (FPGA) IC 840 53248000 840000 1932-BBGA, FCBGA

Quantity 112 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SEE9F45I4G – Stratix® V E Field Programmable Gate Array (FPGA) IC

The 5SEE9F45I4G is a Stratix® V E family FPGA offered in an industrial-grade package optimized for high-density programmable logic. It provides a large logic resource pool, substantial on-chip memory, and a high I/O count, suitable for designs that require extensive programmable fabric and system integration.

Designed for surface-mount applications, this device operates across a wide temperature and supply range and is RoHS compliant, enabling deployment in industrial systems where reliability and long-term availability are priorities.

Key Features

  • Programmable Logic Capacity — Provides 840,000 logic elements for complex digital designs and high-density integration.
  • Embedded Memory — Approximately 53.25 Mbits of on-chip RAM to support large buffering, state machines, and data processing functions.
  • I/O Density — 840 user I/Os to accommodate wide parallel interfaces and multiple peripheral connections.
  • Power and Core Supply — Specified core voltage range of 820 mV to 880 mV for defined power-domain planning in system designs.
  • Industrial Grade and Temperature Range — Rated for industrial use with an operating temperature range of -40 °C to 100 °C.
  • Package and Mounting — Available in a 1932-BBGA (FCBGA) form factor; supplier device package listed as 1932-FBGA, FC (45×45). Surface mount package for modern PCB assembly.
  • Standards Compliance — RoHS compliant to meet lead-free manufacturing requirements.

Typical Applications

  • High-density digital processing — Use the large logic element count and abundant on-chip RAM for data-path acceleration, protocol processing, and complex state machines.
  • Connectivity and I/O aggregation — High I/O count enables aggregation of multiple interfaces or parallel buses in communication and industrial control systems.
  • Industrial control and instrumentation — Industrial temperature grade and robust packaging support deployment in factory automation and instrumentation equipment.

Unique Advantages

  • Extensive logic resources: 840,000 logic elements reduce the need for multiple devices and simplify board-level integration for complex designs.
  • Significant embedded memory: Approximately 53.25 Mbits of on-chip RAM minimizes external memory requirements for many buffering and stateful processing tasks.
  • High I/O count: 840 I/Os provide the flexibility to connect broad parallel buses, multiple peripherals, or dense interfaces without additional multiplexing.
  • Industrial temperature rating: Specified -40 °C to 100 °C operation supports deployment in temperature-challenging environments.
  • Compact surface-mount package: 1932-BBGA / 1932-FBGA (45×45) packaging enables high-density PCB layouts while supporting standard surface-mount assembly processes.
  • RoHS compliant: Conforms to lead-free manufacturing requirements for modern production standards.

Why Choose 5SEE9F45I4G?

The 5SEE9F45I4G brings together a large pool of logic elements, substantial embedded memory, and a very high I/O count in an industrial-grade Stratix V E FPGA package. These characteristics make it well suited for engineers designing high-density, performance-oriented systems that require reliable operation across extended temperature ranges.

With explicit supply voltage and thermal operating windows and RoHS compliance, the device supports disciplined system-level power and thermal planning while fitting into contemporary surface-mount manufacturing flows.

Request a quote or submit an inquiry for pricing and availability to evaluate the 5SEE9F45I4G for your next high-density FPGA design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up