5SEE9F45I4G
| Part Description |
Stratix® V E Field Programmable Gate Array (FPGA) IC 840 53248000 840000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 112 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 317000 | Number of Logic Elements/Cells | 840000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SEE9F45I4G – Stratix® V E Field Programmable Gate Array (FPGA) IC
The 5SEE9F45I4G is a Stratix® V E family FPGA offered in an industrial-grade package optimized for high-density programmable logic. It provides a large logic resource pool, substantial on-chip memory, and a high I/O count, suitable for designs that require extensive programmable fabric and system integration.
Designed for surface-mount applications, this device operates across a wide temperature and supply range and is RoHS compliant, enabling deployment in industrial systems where reliability and long-term availability are priorities.
Key Features
- Programmable Logic Capacity — Provides 840,000 logic elements for complex digital designs and high-density integration.
- Embedded Memory — Approximately 53.25 Mbits of on-chip RAM to support large buffering, state machines, and data processing functions.
- I/O Density — 840 user I/Os to accommodate wide parallel interfaces and multiple peripheral connections.
- Power and Core Supply — Specified core voltage range of 820 mV to 880 mV for defined power-domain planning in system designs.
- Industrial Grade and Temperature Range — Rated for industrial use with an operating temperature range of -40 °C to 100 °C.
- Package and Mounting — Available in a 1932-BBGA (FCBGA) form factor; supplier device package listed as 1932-FBGA, FC (45×45). Surface mount package for modern PCB assembly.
- Standards Compliance — RoHS compliant to meet lead-free manufacturing requirements.
Typical Applications
- High-density digital processing — Use the large logic element count and abundant on-chip RAM for data-path acceleration, protocol processing, and complex state machines.
- Connectivity and I/O aggregation — High I/O count enables aggregation of multiple interfaces or parallel buses in communication and industrial control systems.
- Industrial control and instrumentation — Industrial temperature grade and robust packaging support deployment in factory automation and instrumentation equipment.
Unique Advantages
- Extensive logic resources: 840,000 logic elements reduce the need for multiple devices and simplify board-level integration for complex designs.
- Significant embedded memory: Approximately 53.25 Mbits of on-chip RAM minimizes external memory requirements for many buffering and stateful processing tasks.
- High I/O count: 840 I/Os provide the flexibility to connect broad parallel buses, multiple peripherals, or dense interfaces without additional multiplexing.
- Industrial temperature rating: Specified -40 °C to 100 °C operation supports deployment in temperature-challenging environments.
- Compact surface-mount package: 1932-BBGA / 1932-FBGA (45×45) packaging enables high-density PCB layouts while supporting standard surface-mount assembly processes.
- RoHS compliant: Conforms to lead-free manufacturing requirements for modern production standards.
Why Choose 5SEE9F45I4G?
The 5SEE9F45I4G brings together a large pool of logic elements, substantial embedded memory, and a very high I/O count in an industrial-grade Stratix V E FPGA package. These characteristics make it well suited for engineers designing high-density, performance-oriented systems that require reliable operation across extended temperature ranges.
With explicit supply voltage and thermal operating windows and RoHS compliance, the device supports disciplined system-level power and thermal planning while fitting into contemporary surface-mount manufacturing flows.
Request a quote or submit an inquiry for pricing and availability to evaluate the 5SEE9F45I4G for your next high-density FPGA design.

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