5SEE9F45I4N

The 5SEE9F45I4N is a Stratix V E-series Field Programmable Gate Array (FPGA) offered in an industrial-grade package. It provides high-density programmable logic, substantial on-chip memory, and a large I/O count for complex system designs.

Designed for applications that require significant logic capacity and memory integration, this device combines core FPGA resources with industrial operating range and a compact 1932-ball FCBGA package for surface-mount assembly.

Key Features

• Core Logic — 840,000 logic elements (cells) to implement large-scale programmable logic and custom hardware functions.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM for data buffering, state machines, and accelerator workspaces.
• Logic Structure — 317,000 CLB-style logic blocks (as identified in series documentation) that map to the device's programmable fabric.
• I/O Density — 840 device I/Os to support dense board-level connectivity and multiple high-pin-count interfaces.
• Power — Core voltage supply range from 820 mV to 880 mV, enabling defined power delivery and thermal planning for high-density designs.
• Package & Mounting — 1932-ball BGA (FCBGA) in a 45 × 45 mm footprint, surface-mount compatible for standard PCB assembly processes.
• Temperature Range — Industrial-grade operation from −40 °C to 100 °C for deployment in demanding thermal environments.
• Compliance — RoHS-compliant material status.

Typical Applications

• High-density programmable logic systems — Use the device's 840K logic elements to consolidate complex digital functions into a single FPGA fabric.
• Memory-intensive designs — Leverage approximately 53.25 Mbits of embedded RAM for buffering, packet processing, and on-chip data storage.
• High I/O-count interfaces — Support multi-channel, multi-protocol board designs with up to 840 I/Os for broad peripheral and interface connectivity.
• Industrial equipment — Deploy in systems requiring industrial temperature operation (−40 °C to 100 °C) and surface-mount BGA packaging.

Unique Advantages

• High logic integration: 840,000 logic elements reduce the need for multiple discrete devices and simplify board-level architecture.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM enables large buffers and localized data processing without external memory.
• Extensive I/O availability: 840 I/Os provide flexibility to interface with many peripherals, sensors, or parallel data lanes.
• Industrial thermal resilience: Rated for −40 °C to 100 °C operation for reliable performance in temperature-challenging environments.
• Compact BGA packaging: 1932-ball FCBGA (45 × 45 mm) balances high pin count with a board-friendly surface-mount form factor.
• Controlled core voltage range: 820 mV–880 mV supply window supports predictable power planning and thermal design.

Why Choose 5SEE9F45I4N?

The 5SEE9F45I4N provides a blend of high logic capacity, large embedded memory, and extensive I/O in an industrial-grade Stratix V E device. Its combination of 840,000 logic elements and roughly 53.25 Mbits of on-chip RAM makes it suitable for designs that require consolidated programmable logic and local memory resources while keeping board-level complexity under control.

This device is well suited to engineering teams that require a high-density FPGA in a surface-mount 1932-BBGA package with defined industrial temperature capability and RoHS-compliant materials. The clearly specified core voltage range and I/O count support rigorous electrical and thermal planning for robust system implementations.

Request a quote or submit a procurement inquiry to discuss availability, lead times, and volume pricing for the 5SEE9F45I4N. Our team can provide technical ordering details and support for integrating this Stratix V E FPGA into your design workflow.