5SEE9F45I3LG
| Part Description |
Stratix® V E Field Programmable Gate Array (FPGA) IC 840 53248000 840000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 226 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 317000 | Number of Logic Elements/Cells | 840000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SEE9F45I3LG – Stratix® V E FPGA IC, 840,000 logic elements, approximately 53.25 Mbits RAM, 840 I/Os, 1932-BBGA (FCBGA)
The 5SEE9F45I3LG is a Stratix® V E field programmable gate array (FPGA) IC offered in an industrial temperature grade. It integrates a large core logic capacity, substantial on-chip RAM, and extensive I/O resources in a 1932-ball BGA package for surface-mount applications.
Designed for high-density programmable logic applications that require significant logic elements, embedded memory and a broad I/O count while operating across an industrial temperature range, this device provides a compact, RoHS-compliant solution for system designs that need scalable programmable logic resources.
Key Features
- Core Logic 840,000 logic elements provide substantial programmable logic capacity for complex designs.
- Embedded Memory Approximately 53.25 Mbits of total on-chip RAM to support large buffering, lookup tables and state storage.
- I/O Density 840 user I/Os to accommodate wide parallel interfaces and multiple peripheral connections.
- Power Supply Core voltage supply range of 820 mV to 880 mV for the programmable fabric.
- Package & Mounting 1932-ball BGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type.
- Industrial Temperature Grade Rated for operation from –40 °C to 100 °C, suitable for industrial environments.
- Regulatory RoHS compliant.
Typical Applications
- High-density FPGA designs For projects that require hundreds of thousands of logic elements and tens of megabits of embedded memory.
- Multi-interface systems Designs that need a large number of user I/Os to connect parallel interfaces, sensors or peripherals.
- Industrial control and automation Systems that benefit from industrial temperature operation and high logic capacity for control and sequencing tasks.
Unique Advantages
- Large programmable capacity: 840,000 logic elements enable implementation of complex logic networks and sizable custom accelerators.
- Generous on-chip memory: Approximately 53.25 Mbits of RAM reduces dependency on external memory for buffering and local storage.
- Extensive I/O availability: 840 I/Os support broad connectivity options without requiring additional bridging components.
- Industrial thermal range: –40 °C to 100 °C operation supports deployment in demanding environmental conditions.
- Compact BGA package: 1932-ball FCBGA (45×45) keeps a high resource count in a single surface-mount component for efficient board layouts.
- RoHS compliance: Meets common environmental directives for lead-free assembly.
Why Choose 5SEE9F45I3LG?
The 5SEE9F45I3LG positions itself as a high-density Stratix V E FPGA option that balances large programmable logic resources, substantial on-chip RAM and a high I/O count in a single industrial-grade BGA package. Its voltage and temperature ratings and RoHS compliance make it appropriate for designs that require durable, space-efficient programmable logic.
This device is suitable for engineers and design teams developing complex programmable logic systems that need scalable logic capacity, embedded memory and broad interfacing in industrial environments. Its package and electrical characteristics support compact integration while providing the resources required for advanced FPGA implementations.
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