5SEE9F45I3LN

The 5SEE9F45I3LN is a Stratix V E Field Programmable Gate Array (FPGA) IC in a 1932-BBGA (FCBGA) package, offered in an industrial temperature grade. It provides a high-density programmable logic fabric—840,000 logic elements—with abundant embedded memory and a large I/O count for demanding board-level designs.

This device targets applications that require substantial on-chip resources, combining approximately 53 Mbits of embedded memory, up to 840 I/O pins, and a low-voltage core supply of 0.82–0.88 V, all in a surface-mount 1932-BBGA package.

Key Features

• Core Logic  840,000 logic elements for high-density programmable logic and complex custom hardware implementations.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM to support large buffers, FIFOs, and local data storage without external memory.
• High I/O Count  Up to 840 I/O pins to accommodate wide parallel interfaces, multiple peripherals, and extensive board-level connectivity.
• Power and Supply  Core supply range from 820 mV to 880 mV to match system power-rail design requirements for the Stratix V E core.
• Package and Mounting  1932-BBGA (FCBGA) surface-mount package; supplier device package listed as 1932-FBGA, FC (45×45 mm) for compact, high-density PCB integration.
• Thermal and Environmental  Industrial operating temperature range of −40°C to 100°C and RoHS-compliant construction for regulated environments.

Typical Applications

• High-density digital signal processing  Leverage 840,000 logic elements and ~53 Mbits of embedded memory for implementating large DSP pipelines and data buffering on-chip.
• Complex protocol bridging and interfaces  Use the 840 available I/Os to connect multiple high-pin-count buses, transceiver front-ends, or parallel interfaces at the board level.
• Custom hardware acceleration  Implement application-specific accelerators that require large logic capacity and substantial on-chip RAM to minimize external memory dependence.

Unique Advantages

• Substantial on-chip resources: 840,000 logic elements and approximately 53 Mbits of embedded memory reduce the need for external logic and memory components.
• High I/O density: 840 I/Os simplify system partitioning and reduce interface complexity when integrating multiple peripherals or wide buses.
• Industrial temperature capability: Rated for −40°C to 100°C operation to meet broader environmental and deployment requirements.
• Compact, high-pin-count package: 1932-BBGA (FCBGA) in a supplier 45×45 mm footprint supports dense PCB layouts while providing extensive connectivity.
• Controlled core supply: Defined core voltage range (0.82–0.88 V) supports predictable power design and board-level integration.
• RoHS compliant: Manufactured to meet RoHS requirements for regulated product builds.

Why Choose 5SEE9F45I3LN?

The 5SEE9F45I3LN delivers a high-capacity Stratix V E FPGA implementation tailored for systems that demand significant programmable logic, abundant embedded RAM, and extensive I/O connectivity in an industrial-grade package. Its defined core supply and temperature range support robust, repeatable system integration across demanding deployments.

Choose this device for designs that require long-term scalability of logic and memory resources, high-pin-count interfacing, and a compact surface-mount 1932-BBGA form factor backed by Stratix V device documentation and industrial temperature grading.

Request a quote or submit a procurement enquiry to obtain pricing, availability, and lead-time information for part number 5SEE9F45I3LN.