5SEE9H40C2G
| Part Description |
Stratix® V E Field Programmable Gate Array (FPGA) IC 696 53248000 840000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,021 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-HBGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 317000 | Number of Logic Elements/Cells | 840000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SEE9H40C2G – Stratix® V E FPGA, 696 I/O, 840,000 logic elements
The 5SEE9H40C2G is a Stratix® V E Field Programmable Gate Array (FPGA) from Intel. This commercial-grade device delivers high on-chip logic capacity and memory, along with a large I/O count and a compact FCBGA package for surface-mount board designs.
Key on-chip resources include approximately 840,000 logic elements and approximately 53.25 Mbits of embedded memory, making the device suitable for high-density programmable logic and memory-intensive implementations in commercial electronic systems.
Key Features
- Core logic capacity — Approximately 840,000 logic elements to implement large combinational and sequential logic designs.
- Embedded memory — Approximately 53.25 Mbits of total RAM bits for buffering, FIFOs, and on-chip data storage.
- I/O count — 696 general-purpose I/Os to support wide parallel interfaces and multiple peripheral connections.
- Power rails — Core supply range specified at 870 mV to 930 mV to match platform power delivery requirements.
- Package and mounting — 1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA (45×45). Surface-mount mounting type for standard PCB assembly.
- Operating temperature — Commercial grade rated for 0 °C to 85 °C operation.
- Standards compliance — RoHS compliant.
Typical Applications
- High-density digital processing — Leverage the large logic element count and embedded memory for complex algorithm implementation and data-path acceleration.
- Communications and networking infrastructure — Use the high I/O count and on-chip resources to implement wide parallel interfaces, packet processing, and buffering functions.
- Signal processing and video — Deploy substantial logic and memory resources for real-time signal chains, video pipelines, and frame buffering tasks.
- Prototyping and system integration — Suitable for commercial prototype and production designs that require a high-capacity, reconfigurable logic device in an FCBGA package.
Unique Advantages
- High on-chip logic density: Approximately 840,000 logic elements enable large-scale integration and reduce the need for multiple devices.
- Significant embedded memory: Approximately 53.25 Mbits of RAM bits provide substantial on-chip storage for buffering and state retention without external memory.
- Extensive I/O connectivity: 696 I/Os support broad peripheral interfacing and parallel data paths, simplifying system-level routing.
- Commercial-grade thermal range: Rated for 0 °C to 85 °C operation to meet standard commercial environment requirements.
- Surface-mount FCBGA package: 1517-BBGA footprint in a 45×45 supplier package enables compact, high-density PCB layouts.
- Regulatory compliance: RoHS compliance supports environmentally conscious product builds.
Why Choose 5SEE9H40C2G?
The 5SEE9H40C2G positions itself as a high-capacity Stratix V E FPGA for commercial systems that require substantial programmable logic, abundant on-chip memory, and large I/O capability in a compact surface-mount package. Its specified core supply range and commercial temperature rating make it applicable to a wide range of board-level designs.
Designers looking for scalability in logic and memory resources, coupled with broad interfacing through 696 I/Os and a 1517-BBGA package, will find this device suitable for demanding digital signal processing, communications, and high-density integration tasks.
Request a quote or submit an inquiry to obtain pricing, availability, and lifecycle information for 5SEE9H40C2G. Our team can assist with ordering details and supply options.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018