5SEE9F45C2N
| Part Description |
Stratix® V E Field Programmable Gate Array (FPGA) IC 840 53248000 840000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 424 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 317000 | Number of Logic Elements/Cells | 840000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SEE9F45C2N – Stratix V E FPGA, 840,000 Logic Elements, 1932-BBGA
The 5SEE9F45C2N is an Intel Stratix® V E field programmable gate array (FPGA) in a 1932-BBGA FCBGA package, offering 840,000 logic elements and approximately 53.25 Mbits of embedded memory. Built on the Stratix V family architecture, this commercial-grade device targets high-density, data- and compute-intensive designs that require large logic capacity, extensive I/O, and scalable on-chip memory.
Designed for applications such as system emulation, diagnostic imaging, and instrumentation, the Stratix V E variant delivers the high logic density and fabric resources needed for complex algorithms and large-scale hardware prototyping.
Key Features
- Logic Density Provides 840,000 logic elements to support complex, large-scale designs and high gate counts.
- Embedded Memory Approximately 53.25 Mbits of on-chip RAM organized as industry-standard memory blocks for data buffering and state storage.
- I/O Capacity Up to 840 I/O pins to support wide parallel interfaces and dense board-level connectivity.
- Process and Fabric Part of the Stratix V family based on a 28-nm process node and featuring the family’s adaptive logic modules and multi-track routing architecture.
- DSP and Timing Building Blocks Family-level support includes variable-precision DSP blocks and fractional PLLs to accelerate signal processing and clocking tasks.
- Integrated Hard IP Stratix V family devices include an Embedded HardCopy Block that can be used to harden IP instantiations such as PCIe Gen3/Gen2/Gen1 where applicable to the family.
- Power Supply Range Core voltage operating range of 870 mV to 930 mV for predictable power planning and design validation.
- Package & Mounting 1932-BBGA, FCBGA package (supplier device package: 1932-FBGA, FC, 45×45) suitable for surface-mount assembly.
- Operating Conditions Commercial operating temperature range from 0 °C to 85 °C and RoHS-compliant construction.
Typical Applications
- System Emulation High logic capacity and abundant on-chip memory make this device suitable for hardware emulation of complex ASICs and SoCs during development and verification.
- Diagnostic Imaging Large logic resources and DSP building blocks support image processing pipelines, real-time filtering, and data aggregation tasks.
- Instrumentation Extensive I/O and memory enable complex measurement, control, and data-logging systems for test and measurement equipment.
- Prototyping for Production ASICs Use the Stratix V E device to prototype high-density designs prior to migration to production implementations or HardCopy flows supported by the family.
Unique Advantages
- High Logic Capacity: 840,000 logic elements provide the headroom needed for large designs and advanced algorithms without partitioning across multiple devices.
- Substantial On-Chip Memory: Approximately 53.25 Mbits of embedded RAM reduces external memory dependency and simplifies board-level memory architectures.
- Extensive I/O Count: Up to 840 I/O pins enable direct interfacing with dense, parallel buses and a wide variety of peripherals.
- Family-Level Integration: Stratix V family features—such as ALMs, M20K memory blocks, variable-precision DSPs, and fractional PLLs—provide a consistent fabric for high-performance designs.
- Surface-Mount, High-Pin Package: The 1932-BBGA/1932-FBGA (45×45) package delivers high I/O density in a manufacturable surface-mount form factor.
- Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial deployments.
Why Choose 5SEE9F45C2N?
The 5SEE9F45C2N positions itself as a high-density Stratix V E FPGA option for engineers building compute- and memory-intensive systems. With 840,000 logic elements, substantial embedded memory, and a large I/O footprint in a compact BGA package, it addresses designs that require significant on-chip resources without sacrificing board-level integration.
This device is appropriate for teams developing system emulation platforms, advanced imaging pipelines, and instrumentation where predictable voltage and temperature ranges, family-level IP options, and a robust resource set deliver design scalability and long-term reuse across project phases.
Request a quote or submit a purchase inquiry to check availability and obtain pricing and lead-time information for the 5SEE9F45C2N. Include your quantity and delivery requirements to expedite a response.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018