5SEE9F45C2N

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V E Field Programmable Gate Array (FPGA) IC 840 53248000 840000 1932-BBGA, FCBGA

Quantity 424 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SEE9F45C2N – Stratix V E FPGA, 840,000 Logic Elements, 1932-BBGA

The 5SEE9F45C2N is an Intel Stratix® V E field programmable gate array (FPGA) in a 1932-BBGA FCBGA package, offering 840,000 logic elements and approximately 53.25 Mbits of embedded memory. Built on the Stratix V family architecture, this commercial-grade device targets high-density, data- and compute-intensive designs that require large logic capacity, extensive I/O, and scalable on-chip memory.

Designed for applications such as system emulation, diagnostic imaging, and instrumentation, the Stratix V E variant delivers the high logic density and fabric resources needed for complex algorithms and large-scale hardware prototyping.

Key Features

  • Logic Density  Provides 840,000 logic elements to support complex, large-scale designs and high gate counts.
  • Embedded Memory  Approximately 53.25 Mbits of on-chip RAM organized as industry-standard memory blocks for data buffering and state storage.
  • I/O Capacity  Up to 840 I/O pins to support wide parallel interfaces and dense board-level connectivity.
  • Process and Fabric  Part of the Stratix V family based on a 28-nm process node and featuring the family’s adaptive logic modules and multi-track routing architecture.
  • DSP and Timing Building Blocks  Family-level support includes variable-precision DSP blocks and fractional PLLs to accelerate signal processing and clocking tasks.
  • Integrated Hard IP  Stratix V family devices include an Embedded HardCopy Block that can be used to harden IP instantiations such as PCIe Gen3/Gen2/Gen1 where applicable to the family.
  • Power Supply Range  Core voltage operating range of 870 mV to 930 mV for predictable power planning and design validation.
  • Package & Mounting  1932-BBGA, FCBGA package (supplier device package: 1932-FBGA, FC, 45×45) suitable for surface-mount assembly.
  • Operating Conditions  Commercial operating temperature range from 0 °C to 85 °C and RoHS-compliant construction.

Typical Applications

  • System Emulation  High logic capacity and abundant on-chip memory make this device suitable for hardware emulation of complex ASICs and SoCs during development and verification.
  • Diagnostic Imaging  Large logic resources and DSP building blocks support image processing pipelines, real-time filtering, and data aggregation tasks.
  • Instrumentation  Extensive I/O and memory enable complex measurement, control, and data-logging systems for test and measurement equipment.
  • Prototyping for Production ASICs  Use the Stratix V E device to prototype high-density designs prior to migration to production implementations or HardCopy flows supported by the family.

Unique Advantages

  • High Logic Capacity: 840,000 logic elements provide the headroom needed for large designs and advanced algorithms without partitioning across multiple devices.
  • Substantial On-Chip Memory: Approximately 53.25 Mbits of embedded RAM reduces external memory dependency and simplifies board-level memory architectures.
  • Extensive I/O Count: Up to 840 I/O pins enable direct interfacing with dense, parallel buses and a wide variety of peripherals.
  • Family-Level Integration: Stratix V family features—such as ALMs, M20K memory blocks, variable-precision DSPs, and fractional PLLs—provide a consistent fabric for high-performance designs.
  • Surface-Mount, High-Pin Package: The 1932-BBGA/1932-FBGA (45×45) package delivers high I/O density in a manufacturable surface-mount form factor.
  • Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial deployments.

Why Choose 5SEE9F45C2N?

The 5SEE9F45C2N positions itself as a high-density Stratix V E FPGA option for engineers building compute- and memory-intensive systems. With 840,000 logic elements, substantial embedded memory, and a large I/O footprint in a compact BGA package, it addresses designs that require significant on-chip resources without sacrificing board-level integration.

This device is appropriate for teams developing system emulation platforms, advanced imaging pipelines, and instrumentation where predictable voltage and temperature ranges, family-level IP options, and a robust resource set deliver design scalability and long-term reuse across project phases.

Request a quote or submit a purchase inquiry to check availability and obtain pricing and lead-time information for the 5SEE9F45C2N. Include your quantity and delivery requirements to expedite a response.

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