5CGXFC9E7F35C8N

IC FPGA 560 I/O 1152FBGA
Part Description

Cyclone® V GX Field Programmable Gate Array (FPGA) IC 560 14251008 301000 1152-BGA

Quantity 387 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BGANumber of I/O560Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs113560Number of Logic Elements/Cells301000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits14251008

Overview of 5CGXFC9E7F35C8N – Cyclone® V GX Field Programmable Gate Array (FPGA) IC 560 14251008 301000 1152-BGA

The 5CGXFC9E7F35C8N is a Cyclone® V GX FPGA in a 1152-BGA (35×35) package, offering a high-density programmable fabric targeted at cost-sensitive, high-volume designs. It combines a large logic capacity, embedded memory, and extensive I/O to address applications in industrial systems, wireless and wireline communications, and military markets.

Built on the Cyclone V family architecture and implemented in a low-power 28 nm process, this device delivers integration and power-efficiency advantages through integrated transceivers and hard memory controller capabilities while operating from a core supply range of 1.07 V to 1.13 V.

Key Features

  • Logic Capacity — 301,000 logic elements for implementing complex digital functions and custom accelerators.
  • Embedded Memory — Approximately 14.25 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
  • I/O Density — 560 user I/O pins to interface with multiple peripherals, memory devices, and high-pin-count ecosystems.
  • Packaging & Mounting — 1152-FBGA (35×35) package in a surface-mount form factor suitable for compact board layouts.
  • Power — Core supply range of 1.07 V to 1.13 V with a nominal 1.1 V core voltage as defined for the Cyclone V family, enabling low-power operation.
  • Operating Conditions — Commercial-grade operation from 0 °C to 85 °C.
  • Process & FPGA Fabric — Based on TSMC 28‑nm low-power (28LP) process technology and the Cyclone V device architecture, including enhanced adaptive logic modules and DSP resources.
  • Integrated System Features — Cyclone V family capabilities include integrated transceivers, hard memory controllers, and support for advanced configuration features such as dynamic and partial reconfiguration.
  • Compliance — RoHS compliant for regulatory environmental requirements.

Typical Applications

  • Wireless and Wireline Communications — Implement high-speed transceiver interfaces and packet processing functions using the device’s integrated transceiver and logic capacity.
  • External Memory Interfaces — Use the embedded memory and hard memory controller support for bridging and buffering between processors and external DRAM.
  • Industrial Systems — Enable deterministic control, sensor aggregation, and protocol bridging in automation and machine-control applications.
  • Defense and Aerospace Systems — Support complex signal processing and custom logic implementations where integration and I/O density are required.

Unique Advantages

  • High integration density: 301,000 logic elements and approximately 14.25 Mbits of embedded RAM reduce the need for external logic and memory, simplifying board-level BOMs.
  • Broad I/O capability: 560 I/O pins enable connection to multiple high-speed interfaces, sensors, and memory devices without external expanders.
  • Low-power silicon: Implemented on a 28 nm low-power process and operating around a 1.1 V core range to help reduce system power consumption.
  • Compact, manufacturable package: 1152-FBGA (35×35) surface-mount package supports dense PCB layouts for space-constrained designs.
  • Design flexibility: Cyclone V family features such as adaptive logic modules, embedded memory blocks, DSP resources, and configuration options enable a wide range of custom hardware accelerators and interfaces.

Why Choose 5CGXFC9E7F35C8N?

The 5CGXFC9E7F35C8N combines substantial logic and memory capacity with a high I/O count and a compact 1152‑BGA footprint, making it well suited for designs that require integration of complex digital processing, high-bandwidth interfaces, and extensive external connectivity. Its implementation on 28 nm low-power technology and support for Cyclone V family system features balance performance with power efficiency.

This device is aimed at engineering teams designing cost-sensitive, high-volume products that need a commercially graded FPGA with robust integration options—delivering scalability, reliable supply-chain packaging, and a feature set aligned with communications, industrial, and defense applications.

Request a quote or submit a procurement inquiry to evaluate 5CGXFC9E7F35C8N for your next design. Technical and purchasing teams can provide pricing, availability, and sample options.

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