5CGXFC9E6F35I7
| Part Description |
Cyclone® V GX Field Programmable Gate Array (FPGA) IC 560 14251008 301000 1152-BGA |
|---|---|
| Quantity | 1,735 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BGA | Number of I/O | 560 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 113560 | Number of Logic Elements/Cells | 301000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 14251008 |
Overview of 5CGXFC9E6F35I7 – Cyclone® V GX Field Programmable Gate Array (FPGA) IC 560 14251008 301000 1152-BGA
The 5CGXFC9E6F35I7 is a Cyclone V GX FPGA optimized for integration, low power, and high I/O density. This device combines programmable fabric with GX-class transceivers and hard IP to address cost-sensitive, high-volume applications.
Designed for deployment across industrial, wireless and wireline, military, and automotive markets, the device delivers a balance of logic capacity, embedded memory, and system-level I/O for diverse embedded and communications designs.
Key Features
- Logic Capacity 301,000 logic elements provide substantial programmable fabric for complex custom logic and glue functions.
- Embedded Memory Approximately 14 Mbits of embedded memory (14,251,008 bits) for on-chip buffering, FIFOs, and data storage.
- I/O Density 560 I/O pins support high-pin-count external interfaces and parallel signaling requirements.
- Transceivers and Interfaces Integrated GX-class transceivers support high-speed links referenced in the Cyclone V GX family, enabling serial data connectivity in communications applications.
- Power and Process Built on a 28 nm low-power process with a core supply range of 1.07 V to 1.13 V (nominal 1.1 V), helping reduce system power consumption.
- Package 1152-ball BGA (supplier package: 1152-FBGA, 35×35 mm) for compact, high-density system integration.
- Operating Conditions Industrial-grade operating temperature range of −40 °C to 100 °C for reliable use in demanding environments.
- SoC and Hard IP Cyclone V GX family features such as hard memory controllers and system-level IP (documented in the Cyclone V device overview) facilitate integration with external memory and system processors.
- RoHS Compliance Device is RoHS compliant, supporting regulatory and manufacturing requirements for lead-free assembly.
Typical Applications
- Industrial Systems Used in control, monitoring, and interface roles where industrial temperature range and high I/O count are required.
- Wireless and Wireline Communications Employed in networking and communications equipment that benefit from integrated transceivers and hard memory controllers.
- Military Systems Applicable to defense designs that leverage the device's integration and logic/memory resources for rugged embedded processing tasks.
- Automotive Electronics Suitable for automotive market projects as indicated for the Cyclone V family, providing programmable logic and embedded memory capacity for domain controllers and communication subsystems.
Unique Advantages
- High logic density: 301,000 logic elements enable implementation of large custom functions and complex state machines on a single device.
- Substantial on-chip memory: Approximately 14 Mbits of embedded memory reduces reliance on external RAM for many buffering and data-storage tasks.
- Extensive I/O and connectivity: 560 I/O pins and GX-class transceivers support a wide range of external interfaces and high-speed serial links.
- Low-voltage core: Operates within a 1.07 V to 1.13 V supply window, reflecting the device family’s low-power 28 nm process advantages.
- Industrial operating range: Rated for −40 °C to 100 °C operation, supporting deployment in harsh or temperature-variable environments.
- Compact package footprint: 1152-FBGA (35×35 mm) enables dense PCB implementations while maintaining high pin count.
Why Choose 5CGXFC9E6F35I7?
The 5CGXFC9E6F35I7 delivers a practical combination of logic resources, embedded memory, high I/O count, and GX-class transceiver capability targeted at cost-sensitive, high-volume applications. Its industrial temperature rating and RoHS compliance make it suitable for a broad range of embedded, communications, and defense designs that require on-chip integration and reliable operation.
Organizations selecting this Cyclone V GX device benefit from a device family with documented hard IP and system-level features, enabling streamlined hardware and firmware development for designs that demand both performance and integration.
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