5CGXFC9E6F35I7

IC FPGA 560 I/O 1152FBGA
Part Description

Cyclone® V GX Field Programmable Gate Array (FPGA) IC 560 14251008 301000 1152-BGA

Quantity 1,735 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BGANumber of I/O560Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs113560Number of Logic Elements/Cells301000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits14251008

Overview of 5CGXFC9E6F35I7 – Cyclone® V GX Field Programmable Gate Array (FPGA) IC 560 14251008 301000 1152-BGA

The 5CGXFC9E6F35I7 is a Cyclone V GX FPGA optimized for integration, low power, and high I/O density. This device combines programmable fabric with GX-class transceivers and hard IP to address cost-sensitive, high-volume applications.

Designed for deployment across industrial, wireless and wireline, military, and automotive markets, the device delivers a balance of logic capacity, embedded memory, and system-level I/O for diverse embedded and communications designs.

Key Features

  • Logic Capacity 301,000 logic elements provide substantial programmable fabric for complex custom logic and glue functions.
  • Embedded Memory Approximately 14 Mbits of embedded memory (14,251,008 bits) for on-chip buffering, FIFOs, and data storage.
  • I/O Density 560 I/O pins support high-pin-count external interfaces and parallel signaling requirements.
  • Transceivers and Interfaces Integrated GX-class transceivers support high-speed links referenced in the Cyclone V GX family, enabling serial data connectivity in communications applications.
  • Power and Process Built on a 28 nm low-power process with a core supply range of 1.07 V to 1.13 V (nominal 1.1 V), helping reduce system power consumption.
  • Package 1152-ball BGA (supplier package: 1152-FBGA, 35×35 mm) for compact, high-density system integration.
  • Operating Conditions Industrial-grade operating temperature range of −40 °C to 100 °C for reliable use in demanding environments.
  • SoC and Hard IP Cyclone V GX family features such as hard memory controllers and system-level IP (documented in the Cyclone V device overview) facilitate integration with external memory and system processors.
  • RoHS Compliance Device is RoHS compliant, supporting regulatory and manufacturing requirements for lead-free assembly.

Typical Applications

  • Industrial Systems Used in control, monitoring, and interface roles where industrial temperature range and high I/O count are required.
  • Wireless and Wireline Communications Employed in networking and communications equipment that benefit from integrated transceivers and hard memory controllers.
  • Military Systems Applicable to defense designs that leverage the device's integration and logic/memory resources for rugged embedded processing tasks.
  • Automotive Electronics Suitable for automotive market projects as indicated for the Cyclone V family, providing programmable logic and embedded memory capacity for domain controllers and communication subsystems.

Unique Advantages

  • High logic density: 301,000 logic elements enable implementation of large custom functions and complex state machines on a single device.
  • Substantial on-chip memory: Approximately 14 Mbits of embedded memory reduces reliance on external RAM for many buffering and data-storage tasks.
  • Extensive I/O and connectivity: 560 I/O pins and GX-class transceivers support a wide range of external interfaces and high-speed serial links.
  • Low-voltage core: Operates within a 1.07 V to 1.13 V supply window, reflecting the device family’s low-power 28 nm process advantages.
  • Industrial operating range: Rated for −40 °C to 100 °C operation, supporting deployment in harsh or temperature-variable environments.
  • Compact package footprint: 1152-FBGA (35×35 mm) enables dense PCB implementations while maintaining high pin count.

Why Choose 5CGXFC9E6F35I7?

The 5CGXFC9E6F35I7 delivers a practical combination of logic resources, embedded memory, high I/O count, and GX-class transceiver capability targeted at cost-sensitive, high-volume applications. Its industrial temperature rating and RoHS compliance make it suitable for a broad range of embedded, communications, and defense designs that require on-chip integration and reliable operation.

Organizations selecting this Cyclone V GX device benefit from a device family with documented hard IP and system-level features, enabling streamlined hardware and firmware development for designs that demand both performance and integration.

Request a quote or submit an inquiry to receive pricing, availability, and technical support details for 5CGXFC9E6F35I7.

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