5CGXFC9D6F27I7N

The 5CGXFC9D6F27I7N is an Intel Cyclone® V GX field-programmable gate array (FPGA) in a 672‑BGA package. Built on the Cyclone V device family architecture, it combines high logic density and embedded memory with integrated high-speed interfaces to serve industrial, wireless/wireline and military applications that require substantial on-chip resources with controlled power consumption.

This device provides a balance of performance and integration: large logic capacity, approximately 13.59 Mbits of embedded memory, and a broad I/O complement, all in a compact 672‑FBGA (27 × 27) surface-mount package with industrial temperature grade.

Key Features

• Process and Core — Based on TSMC 28‑nm low‑power (28LP) process; nominal 1.1 V core and specified supply range of 1.07 V to 1.13 V.
• Logic Capacity — 301,000 logic elements to implement complex programmable logic and control functions.
• Embedded Memory — Total on‑chip RAM of 14,251,008 bits (approximately 13.59 Mbits) for embedded data buffers, FIFOs, and state storage.
• ALM and DSP Architecture — Family features include enhanced 8‑input adaptive logic modules (ALMs) and variable‑precision DSP blocks for arithmetic and signal processing tasks.
• I/O and Connectivity — 336 user I/O pins and integrated low‑power serial transceiver support in the Cyclone V family for high‑bandwidth interfaces.
• Packaging and Mounting — Surface‑mount 672‑FBGA (27 × 27) package providing high I/O density in a compact footprint.
• Operating Range — Industrial grade operation from −40 °C to 100 °C.
• Standards and Compliance — RoHS‑compliant device.

Typical Applications

• Industrial control and automation — Use the device’s large logic capacity and robust operating temperature range for motor control, deterministic I/O aggregation, and real‑time processing at the edge.
• Wireless and wireline infrastructure — Leverage on‑chip memory and transceiver capabilities for packet processing, interface bridging, and high‑bandwidth data handling.
• Defense and tactical systems — Apply programmable DSP resources and abundant logic to signal processing, data acquisition, and custom protocol implementations where ruggedized temperature range is required.
• Embedded system integration — Combine logic, embedded memory, and dense I/O to consolidate glue logic, pre‑processing, and custom peripherals into a single FPGA device.

Unique Advantages

• High on‑chip resource density: 301,000 logic elements and approximately 13.59 Mbits of embedded memory reduce dependence on external components and simplify board-level design.
• Compact, high‑I/O package: 672‑FBGA (27 × 27) packaging with 336 I/O supports dense connectivity while maintaining a small PCB footprint.
• Low core voltage and 28LP process: The 1.1 V class core built on a low‑power 28‑nm process helps manage power for cost‑sensitive, volume applications.
• Industrial temperature grade: Specified operation from −40 °C to 100 °C enables deployment in a wide range of environmental conditions.
• Family scalability: Cyclone V family features and compatible package options support migration across device densities for future design scalability.
• Regulatory compliance: RoHS compliance simplifies environmental qualification for many commercial and industrial product lines.

Why Choose 5CGXFC9D6F27I7N?

The 5CGXFC9D6F27I7N delivers a practical combination of logic density, embedded memory, and I/O capacity in a compact 672‑FBGA package suited to industrial and high‑bandwidth applications. Its Cyclone V family architecture gives designers access to advanced ALM structures, DSP resources, and integrated memory blocks while operating within a low‑power core voltage range.

This device is appropriate for teams that need to consolidate functions, reduce BOM count, and scale designs across Cyclone V device options. Its industrial temperature rating and RoHS compliance support long‑life deployments where environmental robustness and regulatory adherence matter.

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