5CGXFC9C6F23C7N

The 5CGXFC9C6F23C7N is a Cyclone® V GX field‑programmable gate array (FPGA) in a 484‑FBGA (23×23) package. Built on the Cyclone V device family architecture, it combines high logic density, on‑chip embedded memory, and family-level hard IP to address bandwidth‑focused and cost‑sensitive designs.

Typical use cases include industrial and communications equipment, military systems, and commercial automotive applications where a commercial‑grade FPGA is acceptable. The device delivers a balance of integration and efficiency thanks to low‑power process technology, embedded memory and DSP capabilities, and multi‑Gbps transceiver support noted at the Cyclone V family level.

Key Features

• Logic Capacity  Approximately 301,000 logic elements for mid-to-high density FPGA implementations.
• Embedded Memory  Approximately 14.25 Mbits of on‑chip RAM (14,251,008 bits) to support large buffering, packet processing, and state storage.
• I/O and Packaging  224 I/O pins in a 484‑FBGA (23×23) surface‑mount package for compact board layouts and broad peripheral connectivity.
• Power and Core Voltage  Core supply range specified at 1.07 V to 1.13 V (family reference core voltage 1.1 V), enabling low‑voltage operation.
• Operating Range  Commercial operating temperature range of 0 °C to 85 °C, suitable for commercial applications.
• Manufacturing and Compliance  Surface‑mount BGA package; RoHS‑compliant.
• Cyclone V Family Capabilities  Family features include TSMC 28‑nm low‑power process technology, enhanced 8‑input adaptive logic modules, variable‑precision DSP blocks, hard memory controllers, and multi‑Gbps transceiver options (family level).

Typical Applications

• Wireless and Wireline Infrastructure  Use the device for protocol processing, packet buffering, and interface bridging where embedded memory and family‑level high‑speed transceivers improve throughput.
• Industrial Control and Instrumentation  Deploy for motor control, real‑time signal aggregation, and deterministic I/O handling leveraging dense logic and on‑chip RAM.
• Military and Aerospace Systems  Appropriate for commercial‑grade systems requiring flexible logic resources and integrated IP blocks from the Cyclone V family.
• Automotive Electronics (commercial‑grade designs)  Applicable in automotive applications that accept commercial‑grade components, using the device’s logic density and memory for dashboards, infotainment, or gateway functions.

Unique Advantages

• High logic density: 301,000 logic elements provide the capacity for complex control, signal processing, and protocol engines without external glue logic.
• Substantial on‑chip memory: Approximately 14.25 Mbits of embedded RAM reduces dependence on external memory for buffering and accelerates data‑path performance.
• Compact, high‑I/O package: 224 I/O in a 484‑FBGA (23×23) gives a dense pinout for multi‑interface designs while keeping board area efficient.
• Low‑voltage core operation: 1.07–1.13 V supply range aligns with the Cyclone V family’s low‑power 28‑nm process to help minimize power budget.
• Family‑level hard IP: Access to Cyclone V features such as adaptive logic modules, DSP blocks, hard memory controllers, and transceiver options supports accelerated system integration.
• Commercial availability and compliance: Surface mount BGA packaging and RoHS compliance simplify procurement and manufacturing for commercial production runs.

Why Choose 5CGXFC9C6F23C7N?

The 5CGXFC9C6F23C7N positions itself as a versatile, commercially graded Cyclone V GX FPGA that balances logic density, embedded memory, and I/O capacity in a compact 484‑FBGA package. It is suited to developers who need substantial on‑chip resources and family‑level hard IP to reduce external components and accelerate development cycles.

Engineers designing communications, industrial, and commercial automotive systems will find the device’s combination of approximately 301,000 logic elements, roughly 14.25 Mbits of embedded RAM, and 224 I/O points ideal for consolidating functions, lowering BOM complexity, and maintaining efficient board layouts while operating within a commercial temperature range.

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