5CGXFC7D6F27I7

The 5CGXFC7D6F27I7 is a Cyclone® V GX field programmable gate array (FPGA) offered in a 672-ball BGA package and specified for industrial use. As a member of the Cyclone V family, this device targets cost- and power-sensitive designs while addressing increasing bandwidth needs through integrated transceivers and hard memory controllers.

Designed on TSMC's 28‑nm low‑power (28LP) process, the device combines substantial logic capacity, embedded RAM, and flexible I/O to serve industrial, wireless and wireline, and military applications that require a balance of integration, efficiency, and thermal tolerance.

Key Features

• Process and Core  Built on TSMC 28‑nm low‑power (28LP) technology with a nominal core voltage around 1.1 V; this part’s supply range is specified at 1.07 V to 1.13 V.
• Logic Capacity  Approximately 149,500 logic elements, providing substantial programmable fabric for custom logic and control functions.
• Embedded Memory  Approximately 7.88 Mbits of on‑chip RAM to support buffers, FIFOs, and embedded data storage without external memory for many use cases.
• I/O and Interfaces  336 user I/Os and device family enhancements including integrated transceivers and hard memory controllers to address high‑bandwidth I/O and external memory interfacing.
• Power and Efficiency  Family-level optimizations for lower power consumption; Cyclone V devices are described as delivering up to 40% lower power versus the previous generation.
• Package and Mounting  672‑FBGA (27 × 27 mm) surface‑mount package (672‑BGA / 672‑FBGA), enabling compact board integration.
• Temperature and Grade  Industrial grade with an operating range of −40 °C to 100 °C suitable for thermally demanding deployments.
• Compliance  RoHS‑compliant for environmental and manufacturing compatibility.

Typical Applications

• Industrial systems  Process control, automation controllers, and other industrial equipment that benefit from high logic density, embedded RAM, and industrial temperature ratings.
• Wireless and wireline communications  Systems requiring integrated transceivers and hard memory controllers for high‑bandwidth data paths and protocol handling.
• Military and defense electronics  Applications that need robust logic resources, embedded memory, and extended temperature operation for fielded systems.

Unique Advantages

• Lower power architecture: Built on a 28‑nm low‑power process and family features that reduce power relative to the prior generation, helping lower system power consumption.
• Substantial programmable capacity: Roughly 149,500 logic elements and approximately 7.88 Mbits of embedded RAM provide headroom for complex logic, buffering, and protocol handling.
• High‑density I/O and integration: 336 I/Os together with integrated transceivers and hard memory controllers reduce external component count for high‑bandwidth designs.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C to support deployed systems in challenging environments.
• Compact package option: 672‑FBGA (27 × 27 mm) surface‑mount package enables dense board layouts while maintaining thermal and IO capabilities.
• RoHS compliance: Meets environmental and manufacturing standards for modern electronics production.

Why Choose 5CGXFC7D6F27I7?

The 5CGXFC7D6F27I7 delivers a balanced combination of logic capacity, embedded memory, I/O density, and industrial thermal range suitable for designers who need integrated bandwidth and efficient power use. As part of the Cyclone V family, it benefits from architecture and packaging choices that support migration across device densities and compact board implementations.

This part is well suited to engineering teams building industrial controls, communications endpoints, and defense electronics that require a robust, high‑capacity FPGA with on‑chip RAM and extensive I/O in a surface‑mount BGA footprint.

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