5CGXFC7D6F27C7N

The 5CGXFC7D6F27C7N is a Cyclone® V GX field programmable gate array (FPGA) IC from Intel, supplied in a 672‑BGA package (672‑FBGA, 27×27). It delivers a large logic capacity with 149,500 logic elements and approximately 7.88 Mbits of embedded memory for demanding logic and on‑chip storage needs.

Designed for cost‑ and power‑sensitive systems, Cyclone V devices support use in industrial, wireless and wireline, and military markets where integrated logic density, configurable I/O, and low core voltage operation are required.

Key Features

• Logic Capacity — 149,500 logic elements to implement complex digital designs with significant parallel resources.
• On‑Chip Memory — Approximately 7.88 Mbits of embedded memory for buffering, state storage, and local data handling.
• I/O Count — 336 user I/O pins to interface with sensors, memory, transceivers, and system peripherals.
• Process and Core Voltage — Built on a 28‑nm low‑power process with a specified supply range of 1.07 V to 1.13 V, enabling lower dynamic power at typical core voltages.
• Packaging and Mounting — Available in a 672‑BGA / 672‑FBGA (27×27) package for high‑density board integration; surface‑mount mounting type.
• Operating Range — Commercial‑grade operating temperature from 0 °C to 85 °C for general industrial and commercial applications.
• Standards Compliance — RoHS‑compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Industrial Automation — Implement control logic, deterministic I/O handling, and local data buffering for factory and process automation systems.
• Wireless and Wireline Infrastructure — Serve as configurable digital front‑end logic, protocol glue, or packet processing in base stations and network equipment.
• Defense and Military Systems — Provide reconfigurable logic and memory resources for mission‑specific processing and interface adaptation.
• Embedded System Integration — Use as a high‑density programmable fabric for integrating custom peripherals, accelerators, or bridging logic within a system design.

Unique Advantages

• Significant Logic Density: 149,500 logic elements enable complex designs and substantial parallel processing capability on a single FPGA.
• Substantial On‑Chip Memory: Approximately 7.88 Mbits of embedded memory reduces dependency on external RAM for many buffering and storage needs.
• High I/O Count: 336 I/O pins provide flexibility to connect multiple peripherals, memory interfaces, and external devices without additional bridge components.
• Low‑Voltage, Low‑Power Operation: Operates within a 1.07 V to 1.13 V supply range and is built on a 28‑nm low‑power process to help control system power consumption.
• Compact, High‑Density Package: 672‑FBGA (27×27) package offers a compact footprint for high‑density PCB designs.
• Commercial Grade and RoHS‑Compliant: Rated for 0 °C to 85 °C operation and compliant with RoHS for broad commercial manufacturing use.

Why Choose 5CGXFC7D6F27C7N?

This Cyclone V GX FPGA part combines high logic capacity, substantial embedded memory, and a large I/O count in a compact 672‑BGA package, making it well suited to designers who need programmable fabric with on‑chip resources for industrial, wireless/wireline, and military applications. The device’s low‑voltage operation and 28‑nm low‑power process foundation align with designs that balance performance and energy efficiency.

For development teams targeting scalable, reconfigurable digital subsystems, the 5CGXFC7D6F27C7N offers a platform that supports complex logic, significant local memory, and flexible I/O while fitting into high‑density board layouts and commercial manufacturing flows.

Request a quote or submit an RFQ to receive pricing and availability information for the 5CGXFC7D6F27C7N Cyclone® V GX FPGA.