5SEEBF45I3G

The 5SEEBF45I3G is an Intel Stratix® V E family field programmable gate array (FPGA) provided in a 1932-ball FCBGA package. This industrial-grade device delivers very high logic density, substantial on-chip embedded memory, and a large number of user I/O pins for complex digital designs.

Designed for systems that require consolidated logic, extensive embedded RAM, and broad I/O capability, the device is specified with an industrial operating temperature range and a low-voltage core supply optimized for modern FPGA workflows.

Key Features

• Core Capacity  Approximately 952,000 logic elements for large-scale logic integration and complex programmable functions.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without external memory.
• I/O Density  840 user I/O pins to support wide parallel interfaces and high channel counts.
• Package  Supplied in a 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45), suitable for surface-mount assembly.
• Power  Core voltage supply specified from 820 mV to 880 mV, enabling operation within defined low-voltage core rails.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-density logic consolidation  Deploy the device where approximately 952,000 logic elements are needed to merge multiple functions into a single FPGA.
• On-chip memory–intensive designs  Use the device when approximately 53.25 Mbits of embedded RAM is required for buffering, large LUTs, or intermediate storage.
• High I/O-count systems  Integrate into designs that require extensive external interfacing using up to 840 user I/Os.
• Industrial-temperature environments  Suitable for systems that must operate reliably between −40 °C and 100 °C due to its industrial grading.

Unique Advantages

• Very high logic density: Approximately 952,000 logic elements enable consolidation of large digital designs into a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces dependence on external memory and improves data-path latency.
• Extensive I/O capacity: 840 I/Os support broad parallel interfaces and high channel counts without additional I/O expanders.
• Industrial operating range: Rated −40 °C to 100 °C for deployment in temperature-demanding applications.
• Low-voltage core operation: Core supply specified from 820 mV to 880 mV for compatibility with low-voltage power architectures.
• RoHS compliant and surface-mount package: 1932-ball FCBGA packaging for high-density PCB assembly while meeting environmental compliance requirements.

Why Choose 5SEEBF45I3G?

The 5SEEBF45I3G combines very high logic capacity, significant on-chip memory, and a large I/O complement in a single industrial-grade Stratix V E FPGA. These attributes make it well suited to designs that demand consolidation of complex logic, high-bandwidth parallel interfacing, and reliable operation across a wide temperature range.

Backed by Intel Stratix V family documentation and industry-standard packaging, the device is targeted at engineering teams requiring a high-density programmable platform with clearly defined electrical and environmental specifications.

If you would like pricing, availability, or to request a formal quote for 5SEEBF45I3G, submit a request and our team will respond with the information you need.