5SEEBF45I3N

The 5SEEBF45I3N is a Stratix V E FPGA device that provides large-scale programmable logic and embedded memory in a surface-mount FCBGA package. Engineered for industrial-temperature applications, it delivers extensive I/O and on-chip resources for complex, compute-intensive system designs.

With 952,000 logic elements and approximately 53.25 Mbits of embedded memory, this device is positioned for designs that require substantial programmable logic capacity, high I/O density, and low-voltage core operation.

Key Features

• Core Logic  952,000 logic elements (logic cells) for implementing large, complex digital designs.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support large buffering, state storage, and algorithm acceleration.
• I/O Density  840 user I/Os to accommodate wide bus interfaces and extensive peripheral connectivity.
• Power  Core supply operating range from 820 mV to 880 mV for low-voltage core operation.
• Package & Mounting  1932-BBGA, FCBGA package (supplier device package: 1932-FBGA, FC, 45×45) in a surface-mount form factor for high-density PCB integration.
• Temperature & Grade  Industrial-grade device rated for operation from –40°C to 100°C for use in demanding environmental conditions.
• Standards Compliance  RoHS compliant.
• Family Information  Part of the Stratix V device family (Stratix V E variant), as described in the Stratix V device documentation.

Typical Applications

• Industrial Control & Automation  Industrial temperature rating (–40°C to 100°C) and high I/O count enable robust control, motor drive interfacing, and distributed automation logic.
• Networking & Packet Processing  Large logic capacity and substantial on-chip RAM support complex packet processing, classification, and buffering functions.
• High-density System Integration  The 1932-BBGA FCBGA package and extensive I/O are suitable for compact boards requiring high pin-count and dense routing.

Unique Advantages

• High logic capacity: 952,000 logic elements enable implementation of large state machines, wide datapaths, and multi-function systems on a single device.
• Significant on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces reliance on external memory for buffering and accelerators.
• Extensive I/O connectivity: 840 I/Os provide flexibility for interfacing with multiple peripherals, wide buses, and parallel interfaces.
• Industrial thermal range: Rated –40°C to 100°C to meet demanding environmental requirements for industrial deployments.
• Low-voltage core operation: Core supply range of 820 mV to 880 mV supports low-voltage system architectures.
• Compact, high-density packaging: 1932-BBGA/1932-FBGA package offers a small footprint for high-pin-count FPGA integration.

Why Choose 5SEEBF45I3N?

The 5SEEBF45I3N combines very large programmable logic capacity, ample embedded memory, and a high I/O count in an industrial-temperature, surface-mount FCBGA package. It is suitable for teams designing complex digital systems that require consolidated logic, large on-chip buffering, and robust operation across a wide temperature range.

This device is well suited to engineering and procurement teams seeking a high-density Stratix V E FPGA for scalable, performance-oriented system designs where on-chip resources and industrial-grade operation are key selection criteria.

Request a quote or submit an inquiry to get pricing and availability information for the 5SEEBF45I3N Stratix V E FPGA.