5SEEBF45I4G

The 5SEEBF45I4G is an Intel Stratix® V E field programmable gate array (FPGA) IC delivering a high-density programmable fabric for complex digital designs. It combines a large logic capacity with substantial on-chip memory and a high I/O count in a compact ball-grid array package.

Produced to industrial grade and specified for surface-mount applications, this device is characterized across electrical and switching parameters in the Stratix V device datasheet, enabling engineering teams to evaluate core, I/O timing, and power behavior for demanding system-level designs.

Key Features

• Core Capacity — 952,000 logic elements (cells) provide extensive programmable logic resources for large-scale designs.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM to support buffering, storage, and memory-heavy functions without external memory.
• High I/O Count — 840 I/O pins for dense peripheral connectivity and multi-channel interfacing.
• Power Supply — Specified voltage supply range of 820 mV to 880 mV for the device core.
• Package — 1932-BBGA, FCBGA package; supplier device package listed as 1932-FBGA, FC (45×45), optimized for high-pin-count surface-mount applications.
• Temperature and Grade — Industrial grade with operating temperature range of −40 °C to 100 °C for deployment in thermally demanding environments.
• Mounting — Surface mount package suitable for modern PCB assembly processes.
• Standards and Documentation — RoHS compliant; detailed electrical and switching characteristics, including I/O timing and programmable I/O element delay, are documented in the Stratix V device datasheet.

Typical Applications

• High-density logic integration — Use the large logic element count to implement complex custom logic, hardware accelerators, and multi-function control systems.
• Memory-intensive functions — Leverage approximately 53.25 Mbits of embedded RAM for data buffering, packet processing, and on-chip storage tasks.
• Dense I/O systems — The 840 I/O pins support designs requiring extensive peripheral interfacing, multi-channel signal routing, or broad sensor/actuator connectivity.

Unique Advantages

• Significant programmable logic — 952,000 logic elements enable consolidation of multiple system functions into a single device, reducing board-level complexity.
• Large on-chip RAM — Approximately 53.25 Mbits of embedded memory minimizes the need for external memory devices for many applications.
• High connectivity — 840 I/Os provide flexibility for multi-interface systems and dense peripheral integration.
• Industrial temperature range — Rated from −40 °C to 100 °C to support deployments in thermally challenging environments.
• Compact, high-pin-count package — 1932-BBGA / 1932-FBGA (45×45) packaging delivers high I/O density in a surface-mount form factor.
• Documented electrical characteristics — Comprehensive datasheet coverage of operating conditions, power, and I/O timing aids accurate system design and validation.

Why Choose 5SEEBF45I4G?

The 5SEEBF45I4G brings a combination of high logic density, substantial embedded memory, and extensive I/O in an industrial-grade Stratix V E FPGA package. Its specified voltage range, documented electrical and switching characteristics, and RoHS compliance make it suitable for engineering teams that require a verifiable, high-capacity programmable device for complex digital systems.

This device is well suited to designs that need to consolidate multiple hardware functions onto a single FPGA, support memory-heavy processing on chip, and maintain broad external connectivity, all while meeting industrial temperature requirements and surface-mount assembly practices.

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