5SEEBF45I4N

The 5SEEBF45I4N is a Stratix V E field programmable gate array (FPGA) in a 1932-BBGA FCBGA package designed for industrial-temperature applications. It provides very large logic capacity, substantial on-chip embedded memory, and a high I/O count for complex digital designs.

With an operating temperature range of −40 °C to 100 °C and a core voltage supply range of 820 mV to 880 mV, this device targets systems that require dense integration and reliable operation across a wide temperature span.

Key Features

• Core logic capacity — 952,000 logic elements to implement large digital designs and complex logic functions.
• Embedded memory — Approximately 53 Mbits of on-chip RAM for deep buffering, state storage, and data processing tasks.
• I/O resources — 840 device I/Os to support wide parallel interfaces, multi-channel connectivity, and dense board-level integration.
• Package & mounting — 1932-BBGA, FCBGA package (supplier device package: 1932-FBGA, FC 45×45) with surface-mount attachment for standard PCB assembly.
• Power — Core supply range of 820 mV to 880 mV for the device core voltage domain.
• Industrial temperature grade — Rated for operation from −40 °C to 100 °C for deployment in demanding environments.
• Standards compliance — RoHS compliant.

Typical Applications

• High-density logic and memory designs — Use the large pool of logic elements and on-chip RAM for complex state machines, datapath acceleration, and deep buffering.
• Multi-interface hubs — High I/O count enables aggregation of many parallel buses, sensors, or peripheral interfaces on a single device.
• Industrial control and automation — Industrial temperature rating and broad I/O complement control systems and embedded automation equipment.

Unique Advantages

• Substantial logic capacity: 952,000 logic elements provide the headroom needed for large-scale FPGA implementations without immediate upscaling.
• Significant embedded memory: Approximately 53 Mbits of on-chip RAM reduces reliance on external memory for many buffering and packet-processing tasks.
• High I/O density: 840 I/Os simplify board-level routing for multi-channel and multi-protocol designs.
• Industrial temperature support: −40 °C to 100 °C operation improves suitability for elevated-temperature and field-deployed systems.
• Compact, surface-mount package: 1932-BBGA FCBGA (45×45) enables dense PCB layouts while supporting automated assembly.
• RoHS compliant: Meets common environmental compliance needs for global manufacturing.

Why Choose 5SEEBF45I4N?

The 5SEEBF45I4N combines very large logic and memory resources with a high I/O count and industrial temperature capability, making it suitable for designs that demand integration of complex digital logic, substantial on-chip buffering, and extensive external connectivity. Its FCBGA package and surface-mount mounting support compact, production-ready board designs.

Engineers and procurement teams who require high-density FPGA resources with documented electrical and operating characteristics can use this device to consolidate functions, reduce external component count, and design for challenging environmental conditions. Manufacturer-provided datasheet information guides electrical, timing, and operating requirements for confident system integration.

Request a quote or submit an inquiry to obtain pricing, lead times, and availability for the 5SEEBF45I4N. Our team can provide additional technical documentation and support to assist with evaluation and deployment.