5SEEBF45I3LG

The 5SEEBF45I3LG is a Stratix® V E field programmable gate array (FPGA) from Intel designed for industrial-grade applications. The device combines a large logic capacity with substantial embedded RAM and a high I/O count to support complex, I/O‑dense designs.

Key value comes from its high logic element count, approximately 53.25 Mbits of on‑chip RAM, broad I/O availability, and an industrial operating temperature range—attributes suited to demanding embedded and system‑level designs.

Key Features

• Logic Capacity  952,000 logic elements for implementation of large-scale logic and custom hardware functions.
• Embedded Memory  Approximately 53.25 Mbits of on‑chip RAM to support buffering, data storage, and high-throughput processing.
• I/O Resources  840 available I/Os to accommodate extensive external interfaces and parallel connections.
• Package and Mounting  1932‑BBGA (FCBGA) package; supplier device package listed as 1932‑FBGA, FC (45×45). Surface-mount mounting type for standard PCB assembly.
• Power  Voltage supply range specified at 820 mV to 880 mV to match platform power delivery requirements.
• Temperature Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in thermally demanding environments.
• RoHS Compliance  Device is RoHS compliant.

Typical Applications

• High-density signal processing  Large logic and embedded memory capacity enable implementation of multi-channel DSP pipelines and custom accelerators.
• Telecom and networking equipment  High I/O count supports dense line interfaces, switching fabrics, and packet processing tasks.
• Industrial control systems  Industrial temperature rating and robust packaging allow deployment in factory automation, motion control, and process control applications.
• Prototyping and system integration  High logic element count and abundant RAM make the device suitable for complex FPGA-based prototypes and system integration platforms.

Unique Advantages

• Large programmable capacity: 952,000 logic elements provide the resources needed for complex state machines, datapaths, and custom logic cores.
• Substantial on‑chip memory: Approximately 53.25 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
• Extensive external connectivity: 840 I/Os enable flexible interfacing to multiple peripherals, sensors, and high-bandwidth external devices.
• Industrial readiness: Rated for −40 °C to 100 °C operation, supporting designs that require extended temperature performance.
• Compact BGA packaging: 1932‑BBGA (45×45) footprint offers a balance of density and board-level routing for complex system boards.
• Regulatory compliance: RoHS compliance for environmental and manufacturing considerations.

Why Choose 5SEEBF45I3LG?

The 5SEEBF45I3LG delivers a combination of very large logic density, significant embedded memory, and a high I/O count in an industrial‑grade Stratix® V E package. These characteristics make it suitable for engineers building complex, I/O‑intensive systems that must operate across a broad temperature range.

For designs that require scalability and on‑chip resources to minimize external components, this device provides a platform-level resource set and package options that align with demanding embedded and system integration projects.

Request a quote or submit an inquiry for part number 5SEEBF45I3LG to receive pricing and availability information.