5SGSED8N2F45C2L

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA

Quantity 534 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSED8N2F45C2L – Stratix® V GS FPGA, 695,000 logic elements, 840 I/Os

The 5SGSED8N2F45C2L is a Stratix V GS field programmable gate array (FPGA) supplied in a 1932-ball FCBGA package for surface-mount assembly. Built on the Stratix V family architecture, this device targets DSP-centric, transceiver-enabled designs that require high logic density, large on-chip memory, and extensive I/O connectivity.

Key value lies in its combination of 695,000 logic elements, approximately 51.2 Mbits of embedded memory, abundant DSP resources, and 840 I/Os—providing a platform for high-throughput signal processing, communications, and compute-accelerated applications while operating within commercial temperature and low-voltage supply ranges.

Key Features

  • Logic Capacity — 695,000 logic elements provide high integration for complex RTL, control, and datapath implementations.
  • Embedded Memory — Approximately 51.2 Mbits of on-chip RAM to support large buffers, FIFOs, and data storage close to logic.
  • DSP Resources — Stratix V GS family includes extensive variable-precision DSP blocks for multiply-accumulate and signal-processing workloads (family-level DSP capabilities documented in device literature).
  • High I/O Count — 840 I/O pins accommodate dense external interfaces and complex multi-board systems.
  • Integrated Transceiver Capability — GS family devices provide integrated transceivers (family documentation cites 14.1‑Gbps capability for GS devices) suitable for backplane and optical-interface applications.
  • Process and Core — Stratix V family devices are built on 28‑nm process technology; this part’s supply voltage is specified at 820 mV to 880 mV.
  • Package and Mounting — 1932-BBGA (FCBGA) surface-mount package, supplier package listed as 1932-FBGA, FC (45×45).
  • Commercial Grade and RoHS — Commercial operating grade with RoHS compliance; operating temperature range 0 °C to 85 °C.

Typical Applications

  • High-performance DSP systems — Use the device’s dense logic and DSP resources for real-time signal processing, filtering, and transform engines in compute-accelerated designs.
  • Telecommunications and Wireline — Integrated transceivers and large memory make it suitable for packet processing, backplane interfaces, and optical transport elements.
  • Broadcast and Video Processing — Large on-chip RAM and abundant logic support real-time video pipelines, encoding/decoding, and media transport functions.
  • High-performance Computing — Leverage high logic density and I/O count for custom accelerator functions and data-path offload in compute systems.

Unique Advantages

  • High integration in a single device: 695,000 logic elements and approximately 51.2 Mbits of embedded memory reduce external component count and board complexity.
  • DSP-optimized architecture: GS-family variable-precision DSP resources enable efficient implementation of multiplies and MAC-heavy algorithms.
  • Extensive external connectivity: 840 I/Os support rich peripheral and multi-lane interfaces without immediate need for external multiplexing logic.
  • Transceiver-enabled designs: Integrated transceiver capability documented for GS devices supports high-speed backplane and optical interfaces.
  • Surface-mount FCBGA package: 1932-ball BGA offers a compact, manufacturable form factor for high-density system boards.
  • Documented process and power envelope: 28‑nm family technology with specified supply range (820 mV–880 mV) supports tightly controlled power designs.

Why Choose 5SGSED8N2F45C2L?

The 5SGSED8N2F45C2L positions itself as a high-capacity Stratix V GS FPGA for applications where dense logic, significant on-chip RAM, and robust DSP/transceiver capability are required. Its combination of 695,000 logic elements, approximately 51.2 Mbits of embedded memory, and 840 I/Os provides design flexibility for complex signal-processing and high-throughput communications designs within a commercial temperature and low-voltage supply envelope.

This part is suited to engineering teams building DSP-centric systems, telecom equipment, broadcast/video platforms, and compute accelerators that need a single, highly integrated FPGA with family-level hard IP and transceiver support documented in Stratix V device literature.

Request a quote or submit an inquiry for pricing and availability to evaluate the 5SGSED8N2F45C2L for your next design.

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