5SGSED8N2F45C2L
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 534 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 262400 | Number of Logic Elements/Cells | 695000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGSED8N2F45C2L – Stratix® V GS FPGA, 695,000 logic elements, 840 I/Os
The 5SGSED8N2F45C2L is a Stratix V GS field programmable gate array (FPGA) supplied in a 1932-ball FCBGA package for surface-mount assembly. Built on the Stratix V family architecture, this device targets DSP-centric, transceiver-enabled designs that require high logic density, large on-chip memory, and extensive I/O connectivity.
Key value lies in its combination of 695,000 logic elements, approximately 51.2 Mbits of embedded memory, abundant DSP resources, and 840 I/Os—providing a platform for high-throughput signal processing, communications, and compute-accelerated applications while operating within commercial temperature and low-voltage supply ranges.
Key Features
- Logic Capacity — 695,000 logic elements provide high integration for complex RTL, control, and datapath implementations.
- Embedded Memory — Approximately 51.2 Mbits of on-chip RAM to support large buffers, FIFOs, and data storage close to logic.
- DSP Resources — Stratix V GS family includes extensive variable-precision DSP blocks for multiply-accumulate and signal-processing workloads (family-level DSP capabilities documented in device literature).
- High I/O Count — 840 I/O pins accommodate dense external interfaces and complex multi-board systems.
- Integrated Transceiver Capability — GS family devices provide integrated transceivers (family documentation cites 14.1‑Gbps capability for GS devices) suitable for backplane and optical-interface applications.
- Process and Core — Stratix V family devices are built on 28‑nm process technology; this part’s supply voltage is specified at 820 mV to 880 mV.
- Package and Mounting — 1932-BBGA (FCBGA) surface-mount package, supplier package listed as 1932-FBGA, FC (45×45).
- Commercial Grade and RoHS — Commercial operating grade with RoHS compliance; operating temperature range 0 °C to 85 °C.
Typical Applications
- High-performance DSP systems — Use the device’s dense logic and DSP resources for real-time signal processing, filtering, and transform engines in compute-accelerated designs.
- Telecommunications and Wireline — Integrated transceivers and large memory make it suitable for packet processing, backplane interfaces, and optical transport elements.
- Broadcast and Video Processing — Large on-chip RAM and abundant logic support real-time video pipelines, encoding/decoding, and media transport functions.
- High-performance Computing — Leverage high logic density and I/O count for custom accelerator functions and data-path offload in compute systems.
Unique Advantages
- High integration in a single device: 695,000 logic elements and approximately 51.2 Mbits of embedded memory reduce external component count and board complexity.
- DSP-optimized architecture: GS-family variable-precision DSP resources enable efficient implementation of multiplies and MAC-heavy algorithms.
- Extensive external connectivity: 840 I/Os support rich peripheral and multi-lane interfaces without immediate need for external multiplexing logic.
- Transceiver-enabled designs: Integrated transceiver capability documented for GS devices supports high-speed backplane and optical interfaces.
- Surface-mount FCBGA package: 1932-ball BGA offers a compact, manufacturable form factor for high-density system boards.
- Documented process and power envelope: 28‑nm family technology with specified supply range (820 mV–880 mV) supports tightly controlled power designs.
Why Choose 5SGSED8N2F45C2L?
The 5SGSED8N2F45C2L positions itself as a high-capacity Stratix V GS FPGA for applications where dense logic, significant on-chip RAM, and robust DSP/transceiver capability are required. Its combination of 695,000 logic elements, approximately 51.2 Mbits of embedded memory, and 840 I/Os provides design flexibility for complex signal-processing and high-throughput communications designs within a commercial temperature and low-voltage supply envelope.
This part is suited to engineering teams building DSP-centric systems, telecom equipment, broadcast/video platforms, and compute accelerators that need a single, highly integrated FPGA with family-level hard IP and transceiver support documented in Stratix V device literature.
Request a quote or submit an inquiry for pricing and availability to evaluate the 5SGSED8N2F45C2L for your next design.

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