5SGSED8N2F45C2LG
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,063 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 262400 | Number of Logic Elements/Cells | 695000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGSED8N2F45C2LG – Stratix V GS FPGA, 840 I/O, 695,000 Logic Elements
The 5SGSED8N2F45C2LG is a Stratix® V GS Field Programmable Gate Array (FPGA) IC in a 1932-BBGA FCBGA package. Designed for commercial-grade systems, this device delivers large on-chip logic and memory resources with a high-density I/O footprint for complex digital designs.
This Stratix V GS device is suited to applications that require substantial programmable logic, large embedded memory, and a high count of I/O signals while operating within commercial temperature and low-voltage core supply conditions.
Key Features
- High Logic Capacity — Approximately 695,000 logic elements to implement large-scale digital functions and custom processor fabrics.
- Logic Block Count — 262,400 logic blocks for structured resource allocation across designs.
- Embedded Memory — Approximately 51.2 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-mapped logic.
- High I/O Density — 840 user I/O pins to enable wide parallel interfaces, multiple buses, and extensive sensor or peripheral connectivity.
- Power and Core Supply — Core supply range specified at 820 mV to 880 mV for devices designed around low-voltage operation.
- Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for standard commercial environments.
- Package and Mounting — 1932-BBGA (FCBGA) package, supplier device package 1932-FBGA, FC (45×45), for surface-mount PCB assembly.
- Environmental Compliance — RoHS compliant.
Typical Applications
- High-density digital processing — Implement large custom datapaths, packet processing, or compute accelerators using extensive logic and embedded RAM.
- Multi-channel I/O systems — Support systems requiring numerous parallel interfaces, wide buses, or mixed signal front ends with 840 I/O pins.
- Communications and protocol bridging — Large logic and memory resources enable complex protocol handling, framing, and buffering functions.
- Programmable system-level integration — Consolidate multiple discrete functions into a single FPGA to reduce board-level component count and simplify integration.
Unique Advantages
- Substantial on-chip logic: Approximately 695,000 logic elements provide headroom for complex, high-gate-count designs.
- Large embedded memory: Approximately 51.2 Mbits of RAM reduces reliance on external memory for buffering and data staging.
- Very high I/O count: 840 I/O pins allow extensive peripheral and parallel bus connectivity without multi-chip solutions.
- Surface-mount, high-density package: 1932-BBGA FCBGA packaging supports compact PCB layouts while exposing a large number of signals.
- Commercial-grade operating range: Rated for 0 °C to 85 °C to meet typical commercial application environments.
- Regulatory consideration: RoHS compliance for standardized environmental requirements.
Why Choose 5SGSED8N2F45C2LG?
The 5SGSED8N2F45C2LG combines very large logic capacity, extensive embedded RAM, and a high I/O count in a single commercial-grade Stratix V GS FPGA package. It is positioned for engineers and system designers who need to integrate substantial programmable logic and memory while maintaining a high level of I/O connectivity in a surface-mount form factor.
This device is well suited to scalable, high-density designs where consolidating functions into one programmable device reduces board complexity and BOM count. Its commercial temperature rating and RoHS compliance support deployment in standard commercial electronics and instrumentation.
Request a quote or submit an inquiry to receive pricing, availability, and package handling details for the 5SGSED8N2F45C2LG.

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