5SGSED8N2F45C3N

The 5SGSED8N2F45C3N is a Stratix V GS field programmable gate array (FPGA) in a 1932-BBGA (FCBGA) package. It is built on the Stratix V family architecture and is optimized for transceiver-based, DSP-centric and data‑intensive applications.

With approximately 695,000 logic elements, about 51.2 Mbits of embedded memory, 840 I/Os and integrated high‑speed transceiver capability, this device targets designs requiring dense logic, large on-chip memory and robust I/O bandwidth while operating within a commercial temperature range.

Key Features

• Device family and process — Stratix V GS device built on 28‑nm process technology from the Stratix V product line.
• Logic capacity — Approximately 695,000 logic elements for complex, high‑density FPGA designs.
• Embedded memory — Approximately 51.2 Mbits of on‑chip RAM implemented using Stratix V embedded memory architecture (M20K memory blocks).
• DSP resources — Stratix V GS family provides abundant variable‑precision DSP blocks suitable for high‑precision digital signal processing implementations.
• I/O and transceivers — 840 general I/Os and integrated transceivers with 14.1‑Gbps capability for backplane and optical interface applications.
• Power — Core supply range specified at 820 mV to 880 mV to support the device's core operation.
• Package and mounting — 1932‑BBGA (FCBGA) surface‑mount package; supplier device package listed as 1932‑FBGA, FC (45×45).
• Operating conditions — Commercial grade device rated for 0 °C to 85 °C.
• Environmental compliance — RoHS compliant.
• Embedded hard IP — Stratix V family includes an Embedded HardCopy Block to support hardened IP instantiation (family-level feature).

Typical Applications

• High‑performance DSP systems — Signal processing in broadcast and high‑performance computing where variable‑precision DSP blocks and large on‑chip memory accelerate algorithms.
• Backplane and optical interfaces — Transceiver capability suitable for backplane and optical link implementations requiring multi‑Gbps channels.
• Network and packet processing — Dense logic and abundant I/O support complex packet processing and traffic management functions.
• Data‑intensive communications — Architectures that require large on‑chip RAM and high I/O bandwidth for buffering and high‑throughput data handling.

Unique Advantages

• High logic density: Approximately 695,000 logic elements enable implementation of large, complex digital designs on a single device.
• Significant on‑chip memory: Roughly 51.2 Mbits of embedded RAM reduce external memory dependence and improve data throughput.
• Integrated high‑speed transceivers: 14.1‑Gbps transceiver capability supports backplane and optical interfaces without separate SerDes components.
• Broad I/O connectivity: 840 I/Os give flexibility for dense board-level connectivity and multi‑lane interfaces.
• Production-ready packaging: 1932‑BBGA FCBGA surface‑mount package suitable for volume assembly and rugged board mounting.
• Commercial temperature rating and RoHS compliance: Suited for mainstream electronics and compliant with RoHS requirements.

Why Choose 5SGSED8N2F45C3N?

The 5SGSED8N2F45C3N positions itself as a high‑capacity, DSP‑focused FPGA solution within the Stratix V GS family, combining large logic resources, substantial embedded memory and integrated transceiver bandwidth in a single commercial‑grade package. This makes it suitable for developers building transceiver‑based signal processing, data plane and high‑throughput communications systems.

Designed on the Stratix V architecture, the device benefits from family‑level features such as M20K embedded memory blocks, flexible DSP resources and embedded hard IP options, offering a clear upgrade path for scalable designs and production flows.

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