5SGSED8N2F45I2L

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA

Quantity 1,734 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSED8N2F45I2L – Stratix® V GS FPGA, 695,000 logic elements

The 5SGSED8N2F45I2L is a Stratix® V GS field-programmable gate array in a 1932-BBGA FCBGA package, designed for DSP-centric and transceiver-based systems. It combines a high logic element count with significant embedded memory and I/O capability for bandwidth- and compute-intensive applications.

Built on the Stratix V family architecture, this GS variant targets applications that require abundant variable-precision DSP resources, integrated high-speed transceivers, and flexible on-chip memory—while supporting industrial temperature operation and surface-mount packaging.

Key Features

  • Logic Capacity — 695,000 logic elements to implement complex programmable logic, control and datapath functions.
  • Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffering, packet processing, and DSP data storage.
  • DSP and Hard IP — Stratix V GS family devices include variable-precision DSP blocks (family supports up to 3,926 18×18 or 1,963 27×27 multipliers) and integrated hard IP blocks for common protocols.
  • High-Speed Transceivers — GS devices in the Stratix V family offer integrated transceivers with up to 14.1 Gbps data-rate capability for backplane and optical interfaces.
  • I/O and Packaging — 840 I/Os in a 1932-BBGA (FCBGA) package, supplier package listed as 1932-FBGA, FC (45×45); surface-mount mounting for compact board integration.
  • Power — Specified core supply range of 820 mV to 880 mV to match system power budgeting and regulator selection.
  • Temperature and Reliability — Industrial grade with an operating temperature range of −40 °C to 100 °C and RoHS compliance for regulatory conformity.

Typical Applications

  • Telecommunications and Optical Transport — High-speed transceivers and large on-chip memory support 40G/100G transport and packet processing functions.
  • Digital Signal Processing — Variable-precision DSP blocks enable high-performance DSP tasks such as filtering, encoding/decoding, and real-time analytics.
  • Network and Test Equipment — High I/O count and integrated hard IP simplify implementation of backplane interfaces and protocol offloads.
  • Broadcast and Military Systems — Industrial temperature range and robust FPGA resources enable deployment in demanding environments that require sustained DSP and I/O throughput.

Unique Advantages

  • High Logic Density: 695,000 logic elements provide the capacity to consolidate multiple functions into a single device, reducing system BOM and board space.
  • Substantial Embedded Memory: Approximately 51.2 Mbits of on-chip RAM reduces dependence on external memory for many buffering and packet-processing tasks.
  • DSP-Optimized Architecture: GS-family support for thousands of multipliers enables efficient implementation of high-precision and high-throughput signal-processing algorithms.
  • Integrated High-Speed I/O: 840 I/Os and family transceiver capabilities (up to 14.1 Gbps for GS) simplify connectivity for high-bandwidth system designs.
  • Industrial Qualification: Rated for −40 °C to 100 °C operation and RoHS compliant to meet industrial deployment requirements.
  • FCBGA Packaging for Dense Boards: 1932-BBGA (45×45) footprint supports high pin-count designs while maintaining surface-mount manufacturability.

Why Choose 5SGSED8N2F45I2L?

The 5SGSED8N2F45I2L positions itself as a programmable platform for systems that demand high DSP throughput, large on-chip memory, and extensive I/O connectivity within an industrial temperature envelope. Its Stratix V GS family attributes—DSP resources, embedded memory, and transceiver capability—make it well suited to communications, broadcast, and compute-accelerated designs.

For teams requiring a scalable, programmable silicon platform with industrial-grade operation and a high pin-count FCBGA package, this device provides a balance of logic, memory, and I/O resources that supports complex system integration and long-term design evolution.

Request a quote or submit an inquiry to discuss availability, pricing, and lead times for the 5SGSED8N2F45I2L. Our team can provide technical details and purchasing information tailored to your project requirements.

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