5SGSED8N2F45I2

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA

Quantity 1,993 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSED8N2F45I2 – Stratix® V GS FPGA, 695,000 logic elements

The 5SGSED8N2F45I2 is an Intel Stratix® V GS field-programmable gate array provided in a 1932-BBGA FCBGA package. It combines high logic density with abundant embedded memory and transceiver/DSP-oriented architecture to support bandwidth- and signal-processing-centric designs.

Targeted at industrial applications, this device offers a large I/O count, a broad operating temperature range, and a low core-voltage supply window to meet demanding system requirements for communications, DSP, and high-performance computing workloads.

Key Features

  • Logic Capacity  695,000 logic elements and 262,400 LABs provide substantial programmable fabric for complex logic and control systems.
  • On‑Chip Memory  Approximately 51.2 Mbits of embedded memory (total RAM bits: 51,200,000) for buffering, lookup tables, and data storage within designs.
  • DSP and Transceiver‑Oriented Architecture  Stratix V GS family architecture includes variable-precision DSP resources and integrated transceivers tailored for transceiver-based, DSP-centric applications.
  • I/O Density  840 user I/Os to support wide external interfacing, high-pin-count peripherals, and complex board-level connectivity.
  • Power and Voltage  Core supply range of 870 mV to 930 mV to match platform power requirements and system power-management approaches.
  • Package and Mounting  1932-BBGA (FCBGA) supplier device package 1932-FBGA, FC (45×45) in a surface-mount form factor for dense board integration.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial-environment deployment needs.
  • Compliance  RoHS-compliant manufacturing to meet regulatory and environmental requirements.

Typical Applications

  • High‑performance DSP systems  Leverage the device’s DSP‑oriented architecture and substantial logic element count for intensive signal processing and algorithm acceleration.
  • Backplane and optical communications  Use integrated transceiver‑capable architecture and high I/O density for packet processing, transport, and interface bridging.
  • Network and compute appliances  Implement complex packet management, traffic shaping, and custom offload logic using the large programmable fabric and embedded memory.
  • Industrial systems  Deploy in industrial control, instrumentation, and broadcast equipment that require extended temperature operation and high integration.

Unique Advantages

  • High logic density: 695,000 logic elements enable implementation of large, complex designs without partitioning across multiple devices.
  • Significant on‑chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching needs.
  • Rich I/O resources: 840 I/Os provide flexibility for multi-channel interfaces and dense board-level connectivity.
  • Designed for DSP workloads: GS family architecture and variable‑precision DSP resources support high-precision and high-throughput signal processing tasks.
  • Industrial readiness: Surface-mount 1932-BBGA package and −40 °C to 100 °C operating range match many industrial deployment requirements.
  • Controlled core supply: Narrow supply window (870–930 mV) supports predictable power provisioning and thermal planning.

Why Choose 5SGSED8N2F45I2?

The 5SGSED8N2F45I2 brings the Stratix V GS family’s DSP- and transceiver-oriented architecture together with substantial logic and memory resources in a single 1932-BBGA package. Its combination of 695,000 logic elements, approximately 51.2 Mbits of embedded memory, and 840 I/Os makes it well suited for communications, high‑performance signal processing, and industrial compute applications where integration and throughput matter.

With an industrial operating temperature range and RoHS compliance, this device provides a production-ready option for engineers seeking a high-density, high-capacity FPGA platform backed by Stratix V family design resources.

If you would like pricing or availability for 5SGSED8N2F45I2, request a quote or submit an inquiry to receive a prompt response from our team.

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